The invention solves the problems of the conductive adhesive with metal as the conductive filler, such as high preparation cost and large change of volume resistance after an aging test.
本发明解决了采用金属作为导电填料的导电胶制备成本高、老化试验后体积电阻变化大的问题。
Spread at least one coating on at least one surface of sandwich layer, contain the resin in the coating and the filler bead of 50% volume at least.
在芯层的至少一个表面上涂上至少一个涂层，涂层中含有树脂和至少50%体积的填料颗粒。
Only when the total volume of filler increases, the conductivity then increases.
只有当填料总的体积含量显著增加时。
The relations of the effective moduli of the composite, the thickness of the hollow sphere wall, volume fraction of the filler, and thickness of the coating were investigated.
为了说明本文结果的有效性，将五相球模型退化为不含涂层空心球填充复合材料的情况，并与文献中的实验数据进行对比。
The relations of the effective moduli of the composite, the thickness of the hollow sphere wall, volume fraction of the filler, and thickness of the coating were investigated.
为了说明本文结果的有效性，将五相球模型退化为不含涂层空心球填充复合材料的情况，并与文献中的实验数据进行对比。
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