Due to the scaling in VLSI technology, high performance digital systems can be realized.
由于超大型积体电路技术在尺寸上的缩减，高效能的数位系统能被实现。
The structured design of integrating software, hardware, computer architecture, VLSI technology and testability together, is introduced.
介绍了综合软件、硬件、计算机体系结构、超大规模集成技术和可测性的设计方法。
With the rapid improvement of VLSI technology and semiconductor technology, the large amounts of hardware which is needed by vector processing can be integrated in a single chip.
VLSI技术和半导体工艺的飞速发展，使向量处理所需的大量硬件可以集成在一块芯片内。
With the development of VLSI technology, a single chip can contain over one billion transistor. Multithreading technique is the developing trend of high performance processor in the future.
随着生产工艺的提高，芯片上能集成越来越多的晶体管，多线程技术也逐步成为一种主流的处理器体系结构技术。
New requirements are presented to interconnection integration technology because of the decreasing feature dimension in VLSI devices.
随着VL SI器件特征尺寸的缩小，对互连集成技术提出了新的要求。
The VLSI testing is being pushed to the high-level based technology.
VLSI集成电路芯片测试技术正在向高层次测试推进。
The high density packaging technology for LSI becomes more and more important as LSI and VLSI are developing rapidly.
随着LSI和VLSI的飞速发展，LS I高密度封装技术变得越来越重要。
Although many of the ultrasonic imaging instruments have been made by digital technology, but we can draw a conclusion that the modern VLSI and EDA technique have not been used efficiently.
尽管很多超声成像仪器设计制造中使用了数字化技术，但是我们可以说现代VLSI和EDA技术在其中并没有得到充分有效的应用。
The research result of this paper has some directive meaning and applicable value in physical design and optimization for VLSI under deep-submicron technology.
本文的研究结果对于深亚微米工艺下的大规模物理设计与优化，具有一定的指导意义和应用价值。
With the rapid growth of Very Large Scale Integration (VLSI) technology and computer technology, DSP has also been used in communication areas more and more widely.
随着超大规模集成电路（VLSI）和计算机技术的飞速发展，数字信号处理（DSP）技术在通信领域中的应用也越来越广泛。
The deep submicron technology presents lots of new challenges to the physical design of VLSI and new techniques are needed in the back-end design flow.
深亚微米下芯片的物理设计面临很多挑战，特别是对于超大规模电路，在后端设计流程上要有新的方法。
The deep submicron technology presents lots of new challenges to the physical design of VLSI and new techniques are needed in the back-end design flow.
深亚微米下芯片的物理设计面临很多挑战，特别是对于超大规模电路，在后端设计流程上要有新的方法。
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