The viscosity shows a rather pronounced variation with temperature .
温度对粘度的影响十分明显。
The stress variation with temperature and isothermal relaxation in copper films deposited onto silicon wafers are studied by fixed point laser reflection method.
采用定点激光反射热循环方法，测量了硅基体上铜膜应力随温度的变化及等温松弛。
In addition the material physical parameter variation with temperature was considered in the model. The contact resistance and flash melt were considered in the electric-heat coupling model;
模型中考虑了电、热、力的耦合以及材料物性参数随温度的变化，在电热耦合模型中计入接触电阻与闪光烧损对产热过程的影响；
In addition the material physical parameter variation with temperature was considered in the model. The contact resistance and flash melt were considered in the electric-heat coupling model;
模型中考虑了电、热、力的耦合以及材料物性参数随温度的变化，在电热耦合模型中计入接触电阻与闪光烧损对产热过程的影响；
应用推荐