All calculations confirm that a compound thickness ratio of 1.2 results in minimal warpage for a large chip TSOP.
所有的计算结果证明化合物厚度比为1.2，会使大芯片TSOP的翘曲问题最小化。
Objective To investigate the diagnosis, treatment and prognosis of lateral and bilateral traumatic superior oblique paralysis (TSOP).
目的通过回顾性研究，对外伤性上斜肌麻痹的诊断、治疗和手术预后进行探讨。
In this thesis, molding process for a typical TSOP product is studied in detail, and FEA (Finite element analysis) has been applied in this process.
本文采用有限元的方法模拟了典型TSOP封装产品的塑封脱模过程。
In this thesis, molding process for a typical TSOP product is studied in detail, and FEA (Finite element analysis) has been applied in this process.
本文采用有限元的方法模拟了典型TSOP封装产品的塑封脱模过程。
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