An initiative scheme is given to integrate the spectrometer, imaging system and high sensitivity photodiode array in a three dimension silicon chip.
讨论了实验分光系统、成像系统和高灵敏度探测器列阵混合集成在一块三维硅基片上的初步方案。
An initiative scheme is given to integrate the spectrometer, imaging system and high sensitivity photodiode array in a three dimension silicon chip.
讨论了实验分光系统、成像系统和高灵敏度探测器列阵混合集成在一块三维硅基片上的初步方案。
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