The invention relates to a thermal interface material and the fillings thereof.
本发明是有关于一种热界面材料与用于其中的填充物。
The invention also provides a method for preparing the thermal interface material.
本发明还提供一种制备上述热界面材料的方法。
And the invention also provides a thermal interface material comprising the fillings.
本发明一并提供一种包含上述填充物的热界面材料。
The thermal interface material includes gap filling fluid and metal particle dispersed in the fluid and capable of reacting with air.
一种热介面材料，包括填隙流体及分散于其中的可与空气反应的金属微 粒。
The thermal interface material provided by the invention has the characteristics of low thermal contact resistance and high heat-conducting efficiency.
本发明提供的热界面材料具有接触热阻小，导热率高的特点。
The thermal interface material provided by the invention has the characteristics of low thermal contact resistance and high heat-conducting efficiency.
本发明提供的热界面材料具有接触热阻小，导热率高的特点。
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