This wastes about half of the wafer material.
这浪费了大概一半的晶圆材料。
The wafer was placed on the powered electrode.
硅片被放置于功率电极上。
The wafer is fixed to the transporting arm through the suction holes.
晶片通过抽吸孔固定到传送臂。
He advanced to his Uncle with the wafer of communion bread in his hand.
他手里拿着圣餐面包和圣饼，向他叔叔走去。
SEM studies show that on the wafer substrate, the film is smooth and dense.
扫描电镜分析表明：获得的薄膜在硅基片上是光滑和致密的。
This equipment is used for blending the cream into tasty stuffing in the wafer.
该设备按配方下料，混合搅拌为可口饼馅。
It's very difficult to make a hole on the wafer with a 45-degree Angle exactly.
在玻璃片上制作精确尺寸的45通孔，并非易事。
The structure and principle of the wafer picking and wafer expanding were discussed.
特别讨论了取片和扩晶动作的结构和原理。
The size of the wafer to wafer side said, the quality of LED is better than small chip.
晶片的大小以边长表示，大晶片LED的品质比小晶片的要好。
During the testing of the integrated circuit (404), it communicates in the wafer test mode.
在集成电路(404)的测试过程中，它在晶片测试模式下通信。
Etch - a process of chemical reactions or physical removal to rid the wafer of excess materials.
蚀刻-通过化学反应或物理方法去除晶圆片的多余物质。
Total Indicator Reading (TIR) - the smallest distance between planes on the surface of the wafer.
总计指示剂数(ir)-晶圆片表面位面间的最短距离。
Haze - a mass concentration of surface imperfections, often giving a hazy appearance to the wafer.
雾度-晶圆片表面大量的缺陷，常常表现为晶圆片表面呈雾状。
The wafer surface condition is improved to some extent, and the production efficiency is increased.
硅片表面状态得到了一定程度的改善，提高了生产效率。
Isopropyl alcohol (IPA) remains inside nano-pore structure on the wafer surface after wafer is cleaned.
清洗结束后，晶圆表面纳米尺度的孔型结构中残留的是异丙醇（IPA）液体。
Normally silicon wafers are cut from a larger piece of silicon. This wastes about half of the wafer material.
硅晶片通常都是从一块较大的硅上裁剪而来，此方式浪费了大概一半的圆晶原料。
The Endura platform is a modular, configurable system used to deposit metals and metal alloys on the wafer.
Endura平台是一种模块化的可配置系统，用来在晶圆上沉积金属和金属合金。
The ZSFD wafer Signal butterfly valve consists of the wafer butterfly valve and the electric control device.
ZSFD型对夹式信号蝶阀是由对夹式蝶阀及电控装置等组成。
The process begins with a four-inch silicon wafer. A coating of metal is added and sputtered across the wafer.
该过程刚开始是利用一个四英寸的硅晶片，然后在其表面溅射一层金属涂层。
Having the understanding of the wafer preparation, we carried out an evaluation of the tool's backside cleaning.
经过了解晶片的预习处理，我们实现了这种清洗设备背面清洗效果的评价。
The flags of PMAC is used as the general I/O interface and the pneumatic control loop of the wafer robot is designed.
并将PMAC的标志控制口改作为通用I/O口，在此基础上进行了硅片传输机器人的气动控制回路的设计。
The wafer is a piezoelectric resonator, expanding and contracting in response to electrical voltages at a precise, extremely high frequency.
该晶片是一个压电谐振器，以精准而极高的频率对电压作出反馈，进行放大和收缩。
Heat from the foot is applied to the top side of the wafer, and cold from the ground is applied on the other side, and voila: electricity.
脚底的热量作用在上层薄片，较冷的地面作用在下层薄片，好了，电就这样产生了。
In case of deviation of the measured average thickness from the specified average value, the Wafer Yield adjustment has to come into force.
万一出现，测量的平均厚度与技术要求的平均厚度出现偏差，晶片的成品率必须进行调整。
Base silicon layer - the silicon wafer that is located underneath the insulator layer, which supports the silicon film on top of the wafer.
底部硅层ꢃ-在绝缘层下部的晶圆片，是顶部硅层的基础。
Consequently, the solder can be formed on or adhered to the first posts by placing the wafer having pre-formed solder onto the first posts.
从而，通过将包括预成型的焊料的晶片放置在所述多个第一柱上，而使得所述焊料可以形成在或者粘附在所述多个第一柱上。
The etch-stop phenomenon as a result of galvanic cell formation is verified by the wafer-level chip and the separated electrodes experiments.
用分立电极实验和芯片级实验验证了原电池钝化引起的腐蚀自停止现象。
Through the silicon bonding, the wafer-level vacuum package is achieved and the wire-bonding PAD is made after all the fabrication work is finished.
在完成整体结构圆片级真空封装的同时通过引线腔结构方便地实现了中间电极的引线。
In the wafer notch detecting part, edge flexion method is adopted to find the notch range, then calculating the notch center by means of arc fitting.
缺口检测先采用边缘变化率算法查找缺口范围，再通过圆弧拟合的方法求出缺口中心位置。
The wafer processing system is an important subsystem of the lithography, which consists of a wafer transmission system and a wafer pre-alignment system.
晶圆处理系统是光刻机的重要组成子系统，其包含两个主要部分：晶圆传输系统和晶圆预对准系统。
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