The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.
建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.
建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。
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