Electroplating is to use the principle of electrolysis in some metal surface plating a thin layer of the other metal and alloy process.
电镀就是利用电解原理在某些金属表面上镀上一薄层其它金属或合金的过程。
It can also avoid pretermission of plating, burnout of zinc layer on weld beam and heat affected zone, and other limitations on the inner surface of fuel tank made of galvanized sheet.
从而避免了传统电镀锌板直接焊接成型油箱内表面漏镀、焊缝及热影响区锌层烧损等缺陷。
In simple terms, plating is required in the surface of the iron and steel materials to be plated with a layer of chromium coating.
简单来说，电镀就是需要在钢铁材料的表面镀上一层较厚的铬镀层。
Metallic coatings, eg. Zinc electrical plating surface: Anti-Corrosion layer.
金螺丝属表层、和表面，如电镀锌金属表面的防腐层。
The fiber is firstly coated with a thin copper or nickel plate with electroless plating method. Then, a thicker nickel plate is coated on the surface of the conductive layer.
提供了保护过程的技术细节，首先在光纤表面进行化学镀处理获得导电的薄镍层或铜层，然后在该导电层上进行电镀镍。
The plasma surface engineering technology as a new processing of preparation of wearable layer of gravure printing can as a substitute for plating was pointed out.
指出了等离子体表面技术可以作为替代电镀制备凹印版材的耐磨层的新工艺。
Tin plating: Immediately after copper plating, a thin layer(0003") of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process."
镀锡：镀铜后在铜表面再镀上一层锡，大约3mil厚，在下工序中起到抗蚀保护线路的作用。
The deduction is confirmed by establishing self locking conditions and determining the sliding friction coefficients between sand and chromium plating layer and between sand and nitrided surface.
通过建立砂粒自锁条件及实测长石砂岩、石英砂岩与泵筒镀铬层或氮化层的滑动摩擦系数值，证实了对柱塞拉伤失效原因的推测是正确的。
More attention was focused on the effects of osmosis on the deposition speed, compositions, surface structure properties of the simultaneously deposited Pd-Ag alloy top layer by electroless plating.
重点研究了渗透压对化学镀共沉积钯银的沉积速度、镀层组成和膜表面结构性能的影响。
A method for autocatalytic plating of silver metal directly onto a silicon surface without the need for an intervening layer of metal is also disclosed.
还公开了在不需要金属中间层的情况下，直接在硅表面上自催化镀覆银金属的方法。
A method for autocatalytic plating of silver metal directly onto a silicon surface without the need for an intervening layer of metal is also disclosed.
还公开了在不需要金属中间层的情况下，直接在硅表面上自催化镀覆银金属的方法。
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