It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
结果表明 ：该工艺镀液稳定 ，可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
LPS is a joint-venture by a famous multinational company and a home state-own-enterprise founding in 1995, who produces surface mounting semiconductor device.
LPS公司于1995年由一家全球知名跨国企业与国内一家电子企业合资兴建，生产表面安装半导体元器件。
LPS is a joint-venture by a famous multinational company and a home state-own-enterprise founding in 1995, who produces surface mounting semiconductor device.
LPS公司于1995年由一家全球知名跨国企业与国内一家电子企业合资兴建，生产表面安装半导体元器件。
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