The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).
随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。
The ACS706 is provided in a small, surface mount SOIC8 package.
ACS706以体积小、表面安装的SOIC 8封装的形式提供。
In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
表面贴装，钢网是锡膏准确重复印刷的关键。
Summarizing the actuality of surface mount inductor, Introduces emphatically the manufacture technology and market of surface mount inductor.
概述了片式电感器现状，着重介绍了片式电感器制造技术与市场。
The sensing element and the measuring ASIC are assembled in a dual-in-line (DIL) plastic package with pins for surface mount and re-flow soldering.
加速度计的敏感元及测量专用芯片（ASIC） 集成在DIL塑料封装内，其引脚可用于表面安装和回流焊接。
Encapsulated surface mount electronics provide resistance to water, oil, dirt, high temperatures, shock and vibrations and overall harsh environments.
表面贴装电子封装提供抗水，油，灰尘，高温，冲击，振动和整体恶劣环境。
A fast three-step path planning algorithm was proposed for automatic optic system to inspect electronic product defects by using surface mount technology.
针对检测表面贴片产品缺陷的光学检测系统，提出一种三阶段的快速路径规划算法。
For mobile communications, computers, various consumer electronics, automotive electronics and other electronic devices, surface mount DC or pulsing circuit.
适用于移动通讯、计算机、各种消费电子、汽车电子等各种电子设备的表面贴装直流或脉动电路。
Design of surface mount PCB makes an impact on soldering quality. The design of soldering pad, track layout, location and through hole treatment are discussed.
表面贴装印制板设计直接影响焊接质量，将专门针对表面贴装印制板的焊盘设计、布线设计、定位设计、过孔处理等实用技术作一些探讨。
In the process of print circuit board (PCB) production, the surface mount is an extremely important step, its speed directly affects the production efficiency.
在印制电路板的生产过程中，表面贴装是极为重要的一环，其速度直接影响着生产效率的高低。
Through hole components welding using traditional manual welding or soldering. The circuit board surface mount components and through-hole components mixed together.
传统的通孔元件的焊接采用波峰焊或手工焊接。目前电路板上表面贴装元件和通孔元件混合在一起。
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.
建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。
A survey to make high density multilayer thick film surface mount assembly and measures adopted for mount design and manufacturing technology for them are introduced.
介绍了研制大面积高密度多层厚膜表面组装件的概况及组装设计与制造工艺上所采取的措施。
RJM resistor MELF Resistors also can be called a wafer resistance, cylindrical-type resistance, non-pin resistance, or non-lead resistance, mainly used for surface mount processing.
又可称为晶圆电阻、圆柱型电阻、无引脚电阻、或无引线电阻，主要用于表面贴装加工过程。
Based on the procedure for parametrical optimization of MEWMA control chart, a case study of its application in surface mount process for the solder joint quality control was presented.
提出了MEWMA控制图参数优化方法，对电子产品装配中的表面贴片工艺过程的焊点质量控制进行了研究。
Surface mount fuse, fast acting.
表面贴装型、快速熔断；
Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper.
本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。
By adopting the Surface Mount Technology (SMT), the circuit is compact structured in a reasonably arranged layout.
电路采用贴片技术，结构紧凑、布局合理。
Surface mount ultrafast rectifier. Max recurrent peak reverse voltage 400 V. Max average forward rectified current 2.0 A.
表面贴装超快整流器。最大的经常峰值反向电压为400 V，最大平均整流电流2.0A。
Surface Mount technology is extensively applied in the assembly of electronic components and PCBs. The article illustrates some of the concerns in SMT processing technology on PCB designs.
表面安装技术在许多电子产品的生产制造中已被大量采用，本文就表面安装PC B设计时需考虑的一些制造工艺性问题进行了阐述。
GLENN ELECTRONICS DEVICES CO. , LTD founded in 1993, is a leading Professional manufactory specialized in designing. producing and distributing equipments and devices of Surface Mount Technology.
格林电子设备有限公司，成立于1993年，是一家集规划、设计、研制、生产和销售整厂自动化设备于一体的专业公司。
Standard surface-mount technology or through-hole techniques provide adequate performance.
标准表面贴装技术或通孔技术提供足够的性能。
GQ-relay. Ultra-small package flat polarized relay. Operating function single side stable. Coil rating 12 V DC. Tape and reel packing. Surface-mount terminal a type.
GQ -继电器。超小型封装扁平极化继电器。操作功能单面稳定。线圈额定值12V直流。磁带和卷轴包装。表面贴装端子A型。
Spring contacts in all form factors can be quickly engineered into highly reliable connector systems, including cabled, coaxial, surface-mount, and double-sided varieties.
各种外形的弹簧触弹针都能够快速结合到极其可靠的连接器系统中，包括接线式、同轴、表面安装和双面种类。
Spring contacts in all form factors can be quickly engineered into highly reliable connector systems, including cabled, coaxial, surface-mount, and double-sided varieties.
各种外形的弹簧触弹针都能够快速结合到极其可靠的连接器系统中，包括接线式、同轴、表面安装和双面种类。
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