Standard surface-mount technology or through-hole techniques provide adequate performance.
标准表面贴装技术或通孔技术提供足够的性能。
GQ-relay. Ultra-small package flat polarized relay. Operating function single side stable. Coil rating 12 V DC. Tape and reel packing. Surface-mount terminal a type.
GQ -继电器。超小型封装扁平极化继电器。操作功能单面稳定。线圈额定值12V直流。磁带和卷轴包装。表面贴装端子A型。
Spring contacts in all form factors can be quickly engineered into highly reliable connector systems, including cabled, coaxial, surface-mount, and double-sided varieties.
各种外形的弹簧触弹针都能够快速结合到极其可靠的连接器系统中，包括接线式、同轴、表面安装和双面种类。
In this part 1 installment, we look at the latest passive components that integrate several discrete parts into smaller, surface-mount versions, saving space and cost and improving performance.
在这第1部分中，我们看到了集成多个分立元件成更小，表面贴装的版本，节省空间和成本，提高性能的最新无源元件。
The wave soldering process may advance welding on the surface mount components damage. Now a lot of circuit board with surface mount components.
采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。现在很多电路板上以表面贴装元件为主。
Encapsulated surface mount electronics provide resistance to water, oil, dirt, high temperatures, shock and vibrations and overall harsh environments.
表面贴装电子封装提供抗水，油，灰尘，高温，冲击，振动和整体恶劣环境。
Through hole components welding using traditional manual welding or soldering. The circuit board surface mount components and through-hole components mixed together.
传统的通孔元件的焊接采用波峰焊或手工焊接。目前电路板上表面贴装元件和通孔元件混合在一起。
A survey to make high density multilayer thick film surface mount assembly and measures adopted for mount design and manufacturing technology for them are introduced.
介绍了研制大面积高密度多层厚膜表面组装件的概况及组装设计与制造工艺上所采取的措施。
The two chips are mounted on a ceramic substrate, and then hermetically sealed in a ceramic surface mount package.
这两款芯片安装在陶瓷基板，然后密封在一个密封的陶瓷表面贴装封装。
For mobile communications, computers, various consumer electronics, automotive electronics and other electronic devices, surface mount DC or pulsing circuit.
适用于移动通讯、计算机、各种消费电子、汽车电子等各种电子设备的表面贴装直流或脉动电路。
Surface mount fast recovery rectifier. Maximum recurrent peak reverse voltage 400 V. Maximum average forward rectified current 1.0 a.
表面贴装快速恢复整流。经常性最大峰值反向电压400V，最大平均整流电流1.0A。
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.
建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。
Surface mount fast switching rectifier. Max repetitive peak reverse voltage 200 V. Max average forward current 1.0 a.
表面贴装快速开关整流器。最大反向重复峰值电压200五，最大平均正向电流1.0A。
Surface mount fast recovery rectifier. Maximum recurrent peak reverse voltage 50 V. Maximum average forward rectified current 1.0 a.
表面贴装快速恢复整流。经常性最大峰值反向电压50V最大平均正向整流电流1.0 A。
Surface mount ultrafast rectifier. Max recurrent peak reverse voltage 400 V. Max average forward rectified current 2.0 A.
表面贴装超快整流器。最大的经常峰值反向电压为400 V，最大平均整流电流2.0A。
Design of surface mount PCB makes an impact on soldering quality. The design of soldering pad, track layout, location and through hole treatment are discussed.
表面贴装印制板设计直接影响焊接质量，将专门针对表面贴装印制板的焊盘设计、布线设计、定位设计、过孔处理等实用技术作一些探讨。
Based on the procedure for parametrical optimization of MEWMA control chart, a case study of its application in surface mount process for the solder joint quality control was presented.
提出了MEWMA控制图参数优化方法，对电子产品装配中的表面贴片工艺过程的焊点质量控制进行了研究。
Surface Mount Component Reflow repair on various substrate materials.
表面贴装元件回流可修复不同衬底材料。
Surface mount devices are packaged on tape and reel for easy auto placement.
表面贴装器件封装在磁带和卷轴，便于自动布局。
The wave soldering process may advance welding on the surface mount components damage.
采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。
In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
表面贴装，钢网是锡膏准确重复印刷的关键。
The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).
随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。
Surface mount fuse, fast acting.
表面贴装型、快速熔断；
In the process of print circuit board (PCB) production, the surface mount is an extremely important step, its speed directly affects the production efficiency.
在印制电路板的生产过程中，表面贴装是极为重要的一环，其速度直接影响着生产效率的高低。
To meet the 2008 Olympic Games, "downsizing" plan, Liard developed a surface mount dual color displays, a lot of time for the training center and game scoring.
为了适应2008年奥运会的“瘦身”计划，利亚德开发了表面贴装双基色显示屏，大量用于训练馆和比赛计时计分系统。
It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package.
它提供了在任何现有的表面上的最高权力能力和最低的导通电阻封装。
The hoods and housings for the HSB series are available with side and top wire entry, through panel or fully enclosed surface mount, and in tall versions for larger wire.
HSB系列的外罩和外壳，通过嵌板或完全密封式的表面安装方式，可提供侧面和顶线入驻，且拥有高版本用于更多配线。
Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper.
本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。
The sensing element and the measuring ASIC are assembled in a dual-in-line (DIL) plastic package with pins for surface mount and re-flow soldering.
加速度计的敏感元及测量专用芯片（ASIC） 集成在DIL塑料封装内，其引脚可用于表面安装和回流焊接。
The sensing element and the measuring ASIC are assembled in a dual-in-line (DIL) plastic package with pins for surface mount and re-flow soldering.
加速度计的敏感元及测量专用芯片（ASIC） 集成在DIL塑料封装内，其引脚可用于表面安装和回流焊接。
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