Powder coating technology is presented. It is found that the pinholes and bulbs in the coating surface are caused by the air gaps within the components to be coated.
介绍云母电容器粉末包封的关键工艺技术，指出包封外观气孔或气泡产生的本质原因是待包封元件内部存在气体间隙。
Powder coating technology is presented. It is found that the pinholes and bulbs in the coating surface are caused by the air gaps within the components to be coated.
介绍云母电容器粉末包封的关键工艺技术，指出包封外观气孔或气泡产生的本质原因是待包封元件内部存在气体间隙。
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