This paper describes the development successfully of super thin and high multi layer board (MLB) using ink jet technology.
概述了应用喷墨技术成功地开发了超薄型和高多层的多层板。
Super speed on heat recovery and widely applied for multi-layer boards and regular uses.
超强回热特性， 补偿温度迅速，适用多层基板及常规使用。
Super speed on heat recovery and widely applied for multi-layer boards and regular uses.
超强回热特性， 补偿温度迅速，适用多层基板及常规使用。
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