In deep submicron era, IC design in physical design has more and more challenge, with the increasing design scale, faster clock frequency and minimizing process dimension.
在深亚微米时代，随着设计规模变大，时钟频率越来越高以及工艺尺寸的减小，IC物理设计面临着诸多困难。
The process of submicron resin adsorption is a kind of rapid reaction, so it is difficult to monitor.
亚微米树脂吸附反应是一种快速反应，离线取样分析较困难。
Since deep submicron manufacturing process is widely used in microprocessors, transient faults have become the main source of chip faults.
随着深亚微米工艺的广泛应用，瞬态故障已成为芯片失效的主要原因。
Compared with the prior art, the method can process the high polymer into submicron particles, and the particles which have uniformly distributed granular diameters are regularly spherical.
与现有技术相比，本发明能够使高聚物加工成亚微米级的粒子， 且粒子粒径分布均一，呈规整球形。
A process for sintering submicron silver powders is described. The surface area of the sinter determined by the BET adsorption isotherm technique is given out in this paper.
介绍了超微银粉烧结过程，并且给出了用BET等温吸附方法测量烧结物表面积的结果。
The reunion reason of boron carbide submicron powders in manufacturing process was analyzed, spray drying and airflow crash were adopted to deal with the materials.
对碳化硼超细微粉在干燥时的硬团聚现象进行了分析，并分别采用喷雾干燥和气流破碎两种方法对物料进行处理。
The reunion reason of boron carbide submicron powders in manufacturing process was analyzed, spray drying and airflow crash were adopted to deal with the materials.
对碳化硼超细微粉在干燥时的硬团聚现象进行了分析，并分别采用喷雾干燥和气流破碎两种方法对物料进行处理。
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