Exposure dose should be changed with the thickness of SU-8 photoresist.
根据SU - 8胶的厚度确定曝光剂量的大小。
The new set of models are more proper for lithography simulation for thick SU-8 resist.
对于厚su - 8胶的模拟，这种模型比普通的模拟模型更加合适。
The 2-d simulation of thick SU-8 photoresist profile after UV lithography is presented.
这篇论文是厚su - 8光刻胶接触式UV光刻后形貌的两维模拟。
SU-8 micro reaction pools are made to contain detection solution to reduce reagent volume and unit cost.
8微反应池用来盛装反应溶液以降低反应液用量及单片成本。
Then, the PDMS was used to cast firstly for the SU-8 microfluidic to obtain a PDMS negative mode structure.
然后，利用PDMS对所制作的SU-8微流沟道进行一次倒模，得到其负模结构；
Silicon wafers, Au and SU-8 are used for making substrates, microelectrodes and micro reaction pools, respectively.
硅片、金及SU - 8分别用作制作衬底、电极及微反应池。
Therefore, novel models for thick chemically amplified photoresist which fit well characters of SU-8 resist is set up.
因而这篇文章包括了我们在厚的化学放大胶光刻模型方面的努力，这些新的模型适用于SU-8胶。
The prototype of the micro actuator is fabricated by means of micro electroforming and SU-8 photolithography techniques.
利用SU-8光刻胶制备电铸模和微电铸工艺，制造了二维微执行器原型。
The new actuator structure is mainly made of SU-8 and it can be bi-directionally driven by electromagnetic force from permanent magnet array.
作者不仅提出了以SU—8胶为主要材料制作执行器的结构，并且提出了通过永磁阵列实现电磁双向驱动。
The process of SU-8 photoresist lithography is researched, and the influence of steps like coating and soft-bake on the lithography is studied.
初步研究了SU-8胶的光刻工艺流程，讨论了涂胶、前烘等各个步骤对光刻结果的影响。
No back plate growing method is to electroform metal microstructure on the metal substrate directly by low-cost UV-LIGA technology based on SU-8 photoresist.
无背板生长法是利用SU - 8光刻胶，通过低成本的UV -LIGA技术，直接在金属基板上电铸镍图形来实现的。
Abstract: the influence of different post exposure bake (PEB) temperature on thermal swelling and the internal stresses of SU-8 photoresist were investigated.
摘要：对不同后烘温度条件下，SU - 8胶在电铸液中的热溶胀性及胶层的内应力大小进行了研究。
Followed is the description of how the SU-8 is evolved in the processes of exposing, postbaking and developing from physical and chemically reaction point of view.
然后从SU - 8胶的物理和化学反应机制方面介绍SU - 8胶的曝光、后烘和显影过程中的变化。
The other is the removal of SU-8, which can be resolved by the combination of marinating in hot acetone, ultrasonic cleanout, RIE and cineration at high temperature.
对于光刻胶的去除用热丙酮泡、超声清洗、反应离子刻蚀和高温灰化法相结合，能达到较好的效果。
Processes of SU-8 photoresist mold and polymer elastomeric stamp were researched in order to solve the technology of the key part—elastomeric stamp in the soft-lithography.
为了解决软光刻技术中核心元件弹性印章的制备技术，对SU-8胶印模和聚合物弹性印章进行了工艺研究。
However, some problems, such as film crack and falling off from the substrate, appear during the subsequent processing because of the high internal stress of SU-8 photoresist.
然而SU - 8胶在工艺过程中会产生很大的内应力，导致在后续的工艺过程中出现胶体开裂，甚至从基底上脱落等现象。
Based on the heating effect of the ultrasonic action, the ultrasonic stress relief was simulated by adding high temperature and high pressure to the crosslinked SU-8 photoresist.
基于超声作用的热效应，本文试图通过对交联的SU - 8胶体系施加高温高压来模拟超声作用对其内应力的消除。
After repeated optimization simulation, a stable cell structure was obtained. The elastic constants of SU-8 photoresist were gained after analysis of the static elastic properties.
在反复进行优化模拟后，对分子模型体系进行了静态力学性能的分析，得到了SU-8胶的力学弹性常数。
Process parameters of SU-8 photoresist based UV-LIGA technique were optimized. The influences of expose time and the wavelength of expose source (on the resist formation) were investigated.
对基于SU - 8胶的UV -LIGA技术进行了工艺优化，研究了光源波长和曝光时间对SU - 8胶成型的影响。
The SU-8 photoresist was performed energy minimization and MD simulation time after time until the system achieved equilibrium completely. And the elastic constants were analysed with analysis tool.
在高温高压下对SU - 8胶反复进行能量最小化和分子动力学模拟，直到体系达到完全的平衡后，分析体系的静态弹性常数。
Run su - postgres -c PSQL, and follow along in Listing 8.
运行su -postgres -cps ql，并执行清单8中的命令。
The rudiments of microneedle actuator have been developed, which is mainly made of SU 8 photoresist, and its 3D construction is fabricated by multistep exposal and electroforming metal.
利用SU - 8光刻胶为主要材料，采用多级曝光和电铸金属实现3D结构的工艺技术，研制出了微针执行器的雏形器件。
The rudiments of microneedle actuator have been developed, which is mainly made of SU 8 photoresist, and its 3D construction is fabricated by multistep exposal and electroforming metal.
利用SU - 8光刻胶为主要材料，采用多级曝光和电铸金属实现3D结构的工艺技术，研制出了微针执行器的雏形器件。
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