You should not have to change your stencil design to accommodate the change to lead-free.
您不需要为更换无铅锡膏而更改钢板设计。
In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.
文章对QFN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。
In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.
文章对QFN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。
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