Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
The finite element analysis (FET) software ANSYS have been used to simulate the temperature and stress distribution in stacked die package under power load.
应用有限元分析软件ANSYS，模拟功率载荷下叠层芯片封装中各层的温度和应力分布。
Structure: Adopting metal stacked technology. Epoxy resin as dip sealed, plastic case as external package.
采用金属化叠片技术，环氧树脂为灌注材料，外部用塑壳封装。
Structure: Adopting metal stacked technology. Epoxy resin as dip sealed, plastic case as external package.
采用金属化叠片技术，环氧树脂为灌注材料，外部用塑壳封装。
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