To keep up speed on the way to the wall, the industry has begun building three-dimensionalchips by stacking circuits on topof one another to increase densities.
在冲向这堵墙的过程中，为了保持速度，通过把集成电路堆叠起来增加密度，闪存业已开始制造三维芯片。
The main factors are reinforcing dike with silt, construction in high speed, soak deformation, poor drainage, stacking load at the tip of dike, impact of vehicle and so on.
大堤开裂的主要原因为背河侧放淤、淤背施工过快、湿化变形、排水不畅、堤顶堆载、车辆作用等。
The main factors are reinforcing dike with silt, construction in high speed, soak deformation, poor drainage, stacking load at the tip of dike, impact of vehicle and so on.
大堤开裂的主要原因为背河侧放淤、淤背施工过快、湿化变形、排水不畅、堤顶堆载、车辆作用等。
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