• We fused the pipes with solders.

    我们用焊锡熔接管子。

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  • He cuts the pieces and solders them together.

    他把那些断片切碎,然后把它们焊在一起。

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  • More than a dozen Turkish solders were also reported killed.

    据报导,有十多名土耳其军人也在战斗中阵亡。

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  • This also applies to solders which can be used under vacuum.

    这同样适用于真空环境下的焊接。

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  • Shelf life policy for solders and other non chemical products.

    焊料及其他非化学产品的保质期政策。

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  • Recently, numerous studies have been published on lead-free solders.

    近年来人们已对无钎焊料进行了广泛的研究。

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  • As soon as the moment for the general offensive arrived, the solders charged the enemy position bravely.

    总攻时间一到,战士们勇猛地向敌人的阵地冲去。

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  • The solderability of electronic solders and some factors that influence the solderability are discussed.

    在熔融状态下无铅焊料合金的行为是影响电子产品微连接钎焊性的关键因素。

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  • While the solders who entered camp on December 19, 1777 were not well-supplied, they were not downtrodden.

    尽管焊料谁进入营地12月19日,1777没有良好的供应,他们不被践踏。

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  • A wettability model of tin based solders is introduced and mathematical manipulation upon it is performed.

    引入了快冷锡基软钎料的浸润性模型,并进行了计算处理。

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  • Objective To explore the influence of psychological intervention on the young-solders with duodenal ulcer.

    目的探讨护理干预对青年战士十二指肠球部溃疡治疗效果的影响。

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  • So it is very necessary to study the wettability of lead-free solders and electromigration of solder joints.

    因此开展低成本无铅焊料润湿性和焊点电迁移研究非常有必要。

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  • Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.

    通孔盘状及平面阵列陶瓷多层电容器焊料所含的铅。

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  • Rated internal pressure is that of the tube being joined. While solders can be used, brazing alloys are recommended.

    h额定内部压力是所连接的管道额定内部压力。如果可以采用焊料,则推荐使用铜焊合金。

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  • One of the main objectives of this study is to develop a generic thermo-mechanical durability model for Pb-free solders.

    这项研究的主要目标之一是建立一个通用的热机械为无铅焊料的耐久性模型。

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  • The disadvantages of three typical lead-free solders, and three problems in the conductive adhesive study are discussed.

    文中介绍了三种典型无铅焊料体系的不足之处,以及银导电胶研究中的三个难题。

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  • Our company also boasts solders of other contents for the option by clients. For details, please contact us for inquiry.

    我公司还备有其它成份焊锡供客户选择,详情请向我公司咨询。

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  • In combination of our recent results, the current status and prospect on lead-free solders has been introduced in detail.

    结合我们的研究成果,详细介绍了无铅钎料开发的现状及前景。

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  • In combination of the recent results, the current status and prospect on lead-free solders has been introduced in detail.

    结合目前的研究成果,详细介绍了无铅钎料开发的现状及前景。

    youdao

  • The selections of glass solders and the corresponding technological parameters are important to the quality of the sealing.

    玻璃焊料的选择与相应的工艺参数对封接件质量起着重要作用。

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  • Choi S. Lee J. Guo F Creep properties of eutectic SnAg solder and Sn- Ag composite solders containing intermetallic particles.

    史耀武。闫焉服。刘建萍金属颗粒增强的锡铅基复合钎料及其制备方法。

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  • In this paper, the influence of alloying element on the oxidation resistance and wettability of low tin solders is investigated.

    研究了合金元素对含稀土低锡钎料抗氧化性和氧化前后润湿性能的变化。

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  • Our company also has solders of other contents for the option by clients. Please refer to the Table of Commonly Used solder Alloy.

    我公司还备有其它成份焊锡供客户选择,请参照常用焊锡合金表。

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  • It is unavoidable that lead-free solders are applied in SMT field in view of the environmental protection and the competitive motivation.

    无论是环境的要求还是作为竞争的筹码,无铅钎料在表面组装领域中的应用已经是不可回避。

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  • When the solders heard this, they were greatly encouraged as if they had already tasted the palms. They marched forward at a faster speed.

    士兵们一听,仿佛已经吃到嘴里,精神大振,步伐不由得加快了许多。

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  • Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

    集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。

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  • Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

    集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅;

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  • It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.

    包括背景,焊料,表面镀层,元器件,基板,组装工艺,返工和无铅焊接的可靠性。

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  • Describes the advantages of the jointly-designed three-chamber vacuum brazing furnace and the construction of vacuum mup and solders used for it.

    叙述了真空保温杯的种类,保温时间及使用寿命,联合设计三室真空钎焊炉的优点以及真空杯的钎焊焊料、结构。

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  • Describes the advantages of the jointly-designed three-chamber vacuum brazing furnace and the construction of vacuum mup and solders used for it.

    叙述了真空保温杯的种类,保温时间及使用寿命,联合设计三室真空钎焊炉的优点以及真空杯的钎焊焊料、结构。

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