Are soldering process control plans up to date and reflecting current processing?
焊接过程控制计划是否是最新的并反映当前的制程？
The wave soldering process may advance welding on the surface mount components damage.
采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。
This paper's actual production of lead-free solder paste and lead-free soldering process has been systematically studied.
本文结合公司的生产实际，对无铅锡膏和无铅焊接工艺进行了系统研究。
Using this product can improve the quality of soldering process, soldering process to achieve the automation and intelligence.
使用本产品能有效地提高焊锡工艺品质，实现了焊锡过程的自动化与智能化。
The ultrasonic soldering process of aluminium heat exchangers and a few important factors effecting on the soldering are reviewed.
论述了铝热交换器的超声波钎焊工艺及其影响钎焊的几个关键因素。
The wave soldering process may advance welding on the surface mount components damage. Now a lot of circuit board with surface mount components.
采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。现在很多电路板上以表面贴装元件为主。
The new soldering process with low void ratio, high efficiency and high quality conformance can be used in the soldering of high reliability power electronics.
采用新焊接方法得到的试样空洞率低、焊接效率高、质量一致性好，可用于高可靠性功率电子产品中。
Solder a variety of ways, all process parameters set by the customers themselves to adapt to a variety of difficult assignments and micro-soldering process solder.
焊锡方式多种多样，全部工艺参数可由客户自行设置，以适应各种高难度的焊锡作业和微焊锡工艺。
However, many problems such as materials selection, soldering process and device, system compatibility are still obsessing the development and application of lead-free solders.
然而无铅化仍然存在材料、工艺、设备、系统兼容等问题。
The selective soldering process offers opportunities to make solder connections on different levels, connecting housing, junction boxes, aluminum parts, stacking PCB's and more.
选择性焊接制程提供相关机会以制造不同层次的焊接，连接元件外壳，接合点，铝部件，多层印刷电路板和其它。
And other manufacturing technologies-interconnect between the chip and microstrip, manufacture of microstrip, solderability of available materials and soldering process are discussed.
同时研究了芯片与微带线间距的互连、微带线制作、材料的可焊性及焊接过程等制造技术。
Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.
此外，利用有限元ansys软件对PC B组件在整个红外再流焊炉中的焊接过程建立了实体模型，进行了PC B组件再流焊全过程的三维动态模拟和仿真。
Process modifications such as solder pot finishes for wave soldering equipment to avoid leaching issues are now available.
为避免出现浸析问题，诸如波焊设备焊锡槽终饰工艺的修改目前已经完成。
Therefore, it is a reliable service for your soldering and welding process to provide full responsibility for the support.
因此，有可靠的服务为您的钎焊及焊接加工提供全面负责的支持。
The process involves a little bit of soldering, but if you can manage that, you can have yourself a new battery quickly and for much less!
过程中涉及到一点点焊的，但如果你能够达到这个目标，你可以有自己新的电池很快，并为少得多！
Design products process flow, e. g. for winding, soldering, assembly.
设计产品生产工艺流程，例如：绕线，焊接，装配。
Design the stencil as common as possible when designing insert reflow soldering stencil, in order to brief technological process and meet better print effect.
在设计插件回流焊印刷模板时，应尽可能设计成普通模板以简化工艺流程和满足较好的印刷效果。
The effective way for improving the quality of wave soldering was discussed in terms of the quality control before soldering and the control of manufacturing material and process parameters.
分别从焊接前的质量控制、生产工艺材料及工艺参数这三个方面探讨了提高波峰焊质量的有效方法。
An aluminum silicon die cast alloy having a very low iron content and relatively high strontium content that prevents soldering to dies into die casting process.
一种铝硅模铸合金，具有非常低的铁含量和相对较高的锶含量，用来防止在模铸过程中焊接在模具上。
A unique oxide thinning process is proposed in order to investigate the effect of oxide thickness on soldering properties.
为研究不同氧化层厚度对焊料性能的影响，开发出一种新的焊料表面氧化层减薄工艺。
Any mechanical force or any excess vibration should be avoid during the cooling process after soldering.
产品在焊锡后冷却过程中避免机械压力和过大震动。
In this paper, a new kind of soldering technique, namely, chemical Heat-treatment sol-dering process (CHSP) is introduced.
介绍了一种新的钎焊技术，即化学热处理钎焊法，并对钎焊机理进行了探讨。
Composition, preparation process and technical properties of the soldering glass are given.
本文介绍了该玻璃的组成、制备工艺及性能。
Appropriate welding material, election of soldering acid, design of welding heat process and cleaning up influenced the welding quality significantly.
合理的焊接材料、钎剂的选择匹配，焊接加热程序的设计，焊接部位的彻底清理将对端环的焊接质量具有极大的影响。
This process is joint Lou broke traditional tin soldering shop, greatly reduce the cost of manufacture process, the difficulty, shorten the production cycle, and improve the welding joint intensity.
该工艺打破了娄似接头采用传统的铺锡钎焊方法，大大降低了工艺程难度、制造成本，缩短了生产周期、提高焊接接头的强度。
The packaging process of vacuum reflowing soldering using in MEMS micro-gyro packaging was built and realized.
实现了MEMS微陀螺仪的真空封装工艺并优化了工艺参数；
The packaging process of vacuum reflowing soldering using in MEMS micro-gyro packaging was built and realized.
实现了MEMS微陀螺仪的真空封装工艺并优化了工艺参数；
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