A uniform, compact, bright lustre, good adhosive and excellent solderable coating was obtained by the experimental electroplating.
经小槽电镀，获得外观致密均匀，似镜面光亮，结合力强，具有优良的可焊性镀层。
When solder bumps (22) on the die are reflowed, the fluxing agent ACTS to remove any oxides present on the solderable surfaces of the substrate or the die.
当管芯上的焊料突点(22)被回流时，该助焊剂的作用是清除基板或管芯的可焊接表面上存在的任何氧化物。
You can omit the thermal reliefs when the plane is quite small, but be careful because the pin may be hardly solderable if the plane is too large.
在电镀面很小时也可以不用限热槽，但是电镀面很大时就需要小心，因为此时不容易焊接。
You can omit the thermal reliefs when the plane is quite small, but be careful because the pin may be hardly solderable if the plane is too large.
在电镀面很小时也可以不用限热槽，但是电镀面很大时就需要小心，因为此时不容易焊接。
应用推荐