Are solderability test samples archived for one year?
焊锡性样品是否至少保留一年？
High solderability due to specially plated electrodes.
具高可焊性特殊电极端子。
This paper deals with results of solderability testing.
本文论述焊料可焊性试验的结果。
SOLDERABILITY: According to lead free soldering profiles.
可焊性：根据无铅焊接概况。
That is why the solderability was measured before and after ageing also.
这就是为什么可焊性要在老化之前和之后分别进行测量。
Deposit properties such as porosity, solderability and adhesion were tested.
测定了锡镀层的孔隙率、可焊性和结合力。
Therefore, solderability of Sn Pb alloy deposit was tested for qualified MLCI products.
对锡-铅合金镀层的耐焊性和可焊性进行了检验以获得合格的MLCI产品。
The solderability of as-plated Pd coatings produced under different process conditions is good.
镀态下，不同条件下制得的钯镀层具有良好的沾锡能力。
Nickel and tin are plated to an aluminum surface possessing solderability and superb conductivity.
镍和锡镀上铝制表面，具备可焊性和卓越的传导性。
Specially including nitrogen chamber to evaluate the effect of nitrogen protection on solderability.
特别配有氮气保护腔，用于评价氮气保护条件对可焊性的影响。
For optimized solderability, chip stock should be used promptly, preferably within 3 years of receipt.
为使其可焊性达到最优化，片式钽电容应及时使用，最在到手的三年之内使用。
The solderability of electronic solders and some factors that influence the solderability are discussed.
在熔融状态下无铅焊料合金的行为是影响电子产品微连接钎焊性的关键因素。
Water vapor aging test whether experiment: discoloration or corrosion, and the subsequent spots solderability.
水蒸气老化实验：测试是否变色或腐蚀斑点，及后续的可焊性。
The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.
引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。
Solderability of Sn Pb alloy deposit is determined by electroplating process and its maintenance, post treatment rinsing, storage of MLCI, etc.
MLCI端头电极锡-铅合金电镀工艺及维护、镀后的清洗、MLCI的储存影响镀层的耐焊性和可焊性。
Good soldering result may be obtained by applying electroless nickel as barrier layer and electroless gold as top layer to provide solderability.
利用化学镀镍作阻挡层，化学镀金作可焊层，可得到良好的焊接效果。
Experiments were made on a range of current densities, in order to obtain a coating with fine appearance. The solderability of coating is evaluated.
试验获得外观良好镀层的电流密度范围，并对镀层的可焊性作了评估。
In view of the poor solderability of metallic film formed on ceramic surface, a secondary metallization of ceramic surface by nickel plating was advanced.
为提高陶瓷金属化层的焊接性能，提出了一种陶瓷二次金属化镀镍工艺。
The solderability depends on a great extent on the wettability, which relates to solid, liquid and gas interfacial tensions of the melted solders on substrates.
钎料的钎焊性能很大程度上取决于钎料对基板的润湿性能，而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。
The physical properties, solderability, mechanical properties and the creep-rupture life of the nanon-sized Ag particles reinforced Sn-37Pb composite solder were investigated.
研究了纳米银颗粒增强锡铅基复合钎料的物理性能、工艺性能、力学性能和蠕变性能。
The solderability of electronic solders depends to a great extent on the wettability, which relates to solid, liquid and gas interfacial tensions of the melted solders on substrates.
钎料的钎焊性能很大程度取决于钎料对基板上的润湿性能，而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。
And other manufacturing technologies-interconnect between the chip and microstrip, manufacture of microstrip, solderability of available materials and soldering process are discussed.
同时研究了芯片与微带线间距的互连、微带线制作、材料的可焊性及焊接过程等制造技术。
The result proves that the process has advantages of high stabilization, excellent solderability and antitarnishing, which may replace high-pollution tin-lead electroplating technology.
结果表明，该添加剂工艺稳定性好，且镀层可焊性优良、抗变色能力强，可取代高污染的锡铅电镀工艺。
This paper balances and analyses the solderability of D36 high-strength ship plate, the whether tiny Ti handling or not, discusses the effect of tiny Ti handling to D36 plate soldering performance.
对比分析了微钛处理与否D36高强度船板的可焊性，分析讨论了微钛处理对D36板焊接性能的影响实质。
This paper balances and analyses the solderability of D36 high-strength ship plate, the whether tiny Ti handling or not, discusses the effect of tiny Ti handling to D36 plate soldering performance.
对比分析了微钛处理与否D36高强度船板的可焊性，分析讨论了微钛处理对D36板焊接性能的影响实质。
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