The second technique involved using braided solder wick and a soldering iron with a blade tip to remove residual solder from the PCB pad.
第二个技术工艺涉及到使用网状焊料芯吸法及有刀片尖的焊接烙铁来除去PC B焊盘上的残余焊料。
Remove excess solder with small brush while plastic leaving a fillet around end of valve as it cools.
当焊料处于粘滞状态时，用刷子把多余的焊料清除干净。焊料冷却后，将一条嵌条环绕在阀门的端口。
Just remove the black wire and the solder that attaches it to the diodes and the same solder that connects the two diode together.
只去掉黑线和连接用的焊锡以及在相同部位连接两个二极管之间的焊锡。
Remove flame and feed solder into the joint at one or two points until a ring of solder appears at the end of the fitting.
把火焰移开，在连接部位一或两点位置将焊料注入直到管件端口出现一环焊料为止。
When solder bumps (22) on the die are reflowed, the fluxing agent ACTS to remove any oxides present on the solderable surfaces of the substrate or the die.
当管芯上的焊料突点(22)被回流时，该助焊剂的作用是清除基板或管芯的可焊接表面上存在的任何氧化物。
You'll probably have to use a "desoldering bulb" and an appropriate solder wick (typically, a fine-woven copper strap) to help remove the original components you're replacing.
你将可能会不得不使用到“吸锡球器”和适当的焊料灯芯(通常为细铜编织带)，以帮助移动你将要替换的原来组成部件。
To smear solder flux paste or colophony on the PCB board of the dismantlement of BGA, remove the tin of welding plate of PCB board with ferrochromium;
在拆除BGA的PCB板焊盘上涂上助焊膏或松香水，用电铬铁将PCB板焊盘上的锡去除；
To smear solder flux paste or colophony on the PCB board of the dismantlement of BGA, remove the tin of welding plate of PCB board with ferrochromium;
在拆除BGA的PCB板焊盘上涂上助焊膏或松香水，用电铬铁将PCB板焊盘上的锡去除；
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