Factors that affect the surface resistance of the board include the board material, the presence of coatings such as solder masking or conformal coatings, and board cleanliness.
影响印制板表面电阻的因素包括印制板材料、有无涂层(例如防焊漆或保形涂层)，以及电路板的清洁。
Used in the masking operation during wave solder process on PCB, prevented electroplating liquid immersing and polluting.
适用于PC b板含浸过程中遮蔽金手指部分和防止电镀液浸入及污染。
Used in the masking operation during wave solder process on PCB.
印刷电路板镀金遮蔽保护用。
Used in the masking operation during wave solder process on PCB.
印刷电路板镀金遮蔽保护用。
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