• Printed circuit board, Solder mask, Flood screen printing, Quality Control.

    印制板阻焊丝网印刷品质控制

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  • PCBA conformal coating, dam process, Solder mask coating, DIP Component fixing.

    PCBA表面三防堤坝工艺涂防焊胶、DIP元件加固等

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  • The solder mask is configured on the dielectric layer and covers the circuit layer.

    罩层配置介电覆盖线路层。

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  • Is the viscosity of the solder mask after preparation checked to ensure the quality?

    检验前是否测试防焊粘性确保品质?

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  • Areas that should not be soldered to may be covered with a polymer solder resist (solder mask) coating.

    区域应该焊接可以覆盖抵抗焊接聚合物涂料。

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  • Screen Print: Solder mask coating will cover completely the panel holes, pads and traces, on both sides.

    两面完全覆阻油墨,包括导通盘。

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  • The text on the two solder mask layer is same, we will cancel the text that on this solder mask layer, please refer to Q9.

    字符与另一层绿油上的字元相同确认是否可以取消此层上的该字符。请看Q9处。

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  • The text on the solder mask layer is overlapping the text that on the circuit layer. We suggest move it away. Please refer to Q7.

    绿油层字符与线路上的字符重叠在一起,建议绿油层的字符移请看Q7处

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  • The circuit board comprises a dielectric layer, a circuit layer and at least one electricity-conducting joint pole and a solder mask.

    一种电路板其包括介电线路层、至少导电接合罩层

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  • Please see below picture, those letters overlap at circuit layer and solder mask. We suggest deleting the letters in solder mask layer.

    如图那些线路都有,我们建议删除阻焊上的字。

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  • The execution of the liquid photoimageable solder mask of the printed circuit board was briefly introduced. The process and its quality control were also illuminated.

    本文印制板液态感光成形阻焊剂制作进行了简单介绍对该制程的工艺过程品质控制进行了较为详细的论述。

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  • The manufacture of liquid photosensitive solder mask for PCB by screen printing is briefly introduced. The process and its quality control are also discussed in detail.

    印制板采用丝网印刷液态感光成形阻焊剂制作进行了简单介绍,并对制作工艺品质控制进行了较为详细的论述。

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  • The solder mask layer is formed on the flexible dielectric layer to locally cover the pins and to cover or expose the reinforced metal patterns according to different application.

    形成于该可挠性介电层上,局部覆盖该些脚,不同应用可覆盖显露补强金属图案

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  • A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.

    种改善变形半导体封装基板主要包括可挠性介电多数引脚至少补强金属图案以及一防层。

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  • In addition, the solder mask coating on printed circuit board, with the plasma treatment, can also obtain certain roughness and high active surface, thus improving the solder coating adhesion.

    另外覆前,等离子体印制电路板面处理一下,获得一定粗糙度高活性表面从而提高阻焊层的附着力

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  • Resist: coating material used to mask or to protect selected areas of a pattern from the action of an etchant solder or plating.

    剂:用来选择性保护图形区域免受蚀刻剂,焊料或电镀影响涂层材料

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  • Resist: coating material used to mask or to protect selected areas of a pattern from the action of an etchant solder or plating.

    剂:用来选择性保护图形区域免受蚀刻剂,焊料或电镀影响涂层材料

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