At this stage, it's easy to remake a solder connection if there is a problem.
在这一阶段，如果存在问题，可以很容易地改造焊接的连接点。
This paper describes the current status and theme of mounting technology and density rise and low temperature solder connection in the future.
概述了安装技术的现状、课题和将来的密度提高和低温焊料连接。
This paper describes the current status and theme of mounting technology and density rise and low temperature solder connection in the future.
概述了安装技术的现状、课题和将来的密度提高和低温焊料连接。
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