Provided is a surface mounting component wherein a shock applied to constitution members in manufacturing process is reduced and sufficient solder bonding strength is achieved after surface mounting.
提供一种表面安装部件，其可以缓和对制造工序中的构成组件产生的冲击，并使表面安装后的焊接强度的达到充分大。
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
The solder alloy of the invention is suited to bonding oxides together and the oxides preferably comprise glass.
本发明的焊料合金优选为能够很好地接合氧化物和氧化物彼此，所述氧化物为玻璃。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
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