It was introduced how to change single layer ceramic disc components with leads into chip components on the basis of single layer ceramic discs.
介绍了在单层陶瓷圆片的基础上实现单层陶瓷圆片带引线元件的片式化。
It was introduced how to change single layer ceramic disc components with leads into chip components on the basis of single layer ceramic discs.
介绍了在单层陶瓷圆片的基础上实现单层陶瓷圆片带引线元件的片式化。
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