The simulation value of solder joint thermal fatigue life is 1 052 circulations. The thermal fatigue life of solder joint in SCSP is lower than the single chip package (2 656 circulations).
SCSP的焊点热疲劳寿命模拟值为1 052个循环周，低于单芯片封装元件的焊点热疲劳寿命(2 656个循环周)。
The analysis of the simulation value compared with the test results of pipe fittings bended Angle proved the validity of the Finite Element Modeling the tubes bended forming process.
通过对管件弯曲角度的试验结果与模拟值的对比分析，证明了建立管件有限元模型的正确性。
The analysis of the simulation value compared with the test results of pipe fittings bended Angle proved the validity of the Finite Element Modeling the tubes bended forming process.
通过对管件弯曲角度的试验结果与模拟值的对比分析，证明了建立管件有限元模型的正确性。
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