Other example embodiments include layer thicknesses in excess of those used in normal semiconductor processing.
其他示例实施例包括厚度超过了在通常的半导体工艺中使用的厚度的层。
Although these products were designed for semiconductor processing applications, they have been proven useful in other industries.
虽然这些产品是为半导体加工应用而设计的，他们已被证明在其他行业也被很好的使用。
Semiconductor processing techniques are being utilized to fabricate multichannel microelectrode probes for recording neural signals from central nervous system.
为了从中枢神经系统记录电信号，半导体加工技术已经被用于微电极探针的制造。
Methods of applying specialty ceramic materials to semiconductor processing apparatus, where the specialty ceramic materials are resistant to halogen-comprising plasmas.
本发明提供了一种对于半导体处理中使用的含卤素等离子体耐腐蚀的陶 瓷制品。
The present invention provides a memory control device and a semiconductor processing apparatus which can be flexibly made adapted to a plurality of kinds of semiconductor memories.
本发明提供了一种存储器控制设备和半导体处理装置，其可以灵活地形成以适应于多种半导体存储器。
The MIT 1000 System has numerous ID applications including food quality control, clinical diagnostics, pharmaceutical quality assurance, semiconductor processing control and water quality monitoring.
MIT 1000具有广泛的鉴定用途，包括食品质量控制、临床诊断、药品质量保证、半导体处理控制及水质监测等。
The only problem is that Green's methods rely on advanced and expensive processing technology borrowed from the semiconductor industry.
唯一的问题就是：格林的方法依赖于高科技且借助于半导体产业昂贵的处理技术。
Plasma processing technology is a new technology developed in semiconductor manufacturing.
等离子体加工技术是在半导体制造中创立起来的一种新技术。
The invention provided a semiconductor device which has a very high tamper resistance to improper analysis means due to FIB processing or the like from rear surface.
本发明提供一种半导体器件，对利用从背面进行的FIB加工等实施的不正当解析手段具有极高的抗篡改性。
The laser target shooting system consists of semiconductor laser gun, photoelectric detector, and signal processing circuit, which is the key part of the whole system.
激光打靶系统主要包括半导体激光枪、光电探测器和信号处理电路，信号处理过程是整个系统的关键。
The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation.
自动冲切成形系统是半导体集成电路封装引线框架后的加工专用系统。
The automatic measurement system and the data processing method are discussed for microspot photocurrent spectrum and reflection spectrum of semiconductor optoelectronic devices.
叙述了为测量半导体光电器件的光电流谱和光反射谱所构成的自动测量系统及其数据处理方法。
They appear in industrial processing, such as semiconductor manufacturing, and also in planetary environments, such as in Saturn's B ring.
粉尘电浆出现在一些工业加工过程中，如半导体制造，也出现在天体环境中，如土星B环。
Semiconductor wafer processing. Single or dual chamber, 25-wafer batch processing offers high-performance wafer cleaning, rinsing and drying.
半导体晶片处理。单或双室，25晶圆批量处理提供高晶片清洁，冲洗和脱水功能。
We specialized in manufacturing pick bean curd, red vinasse, semiconductor consume materials, hardware processing for machinery, etc.
本公司专门致力于豆腐乳，红糟，半导体耗材，机械五金加工。
With the rapid improvement of VLSI technology and semiconductor technology, the large amounts of hardware which is needed by vector processing can be integrated in a single chip.
VLSI技术和半导体工艺的飞速发展，使向量处理所需的大量硬件可以集成在一块芯片内。
Clean areas including the warehouses, hospitals. Etc. Dust-free rooms including the laboratories, apparatus rooms, semiconductor rooms, precisely interated circuit processing rooms, etc.
仓库、医院等洁净场所。实验室、仪器室、半导体、体积电路精密加工等无尘室。
The present invention provides a system for use in processing semiconductor workpieces.
本发明提供一种用于加工半导体工件的系统。
To provide a method and apparatus for heating fluid in the proximity head of a semiconductor wafer processing system.
提供了一种用于加热接近头中的流体的设备和方法。
Methods of processing semiconductor substrates using the showerhead electrode assemblies are also disclosed.
还公开使用这些喷头电极总成处理半导体基片的方法。
The present invention provides a data processing circuit, a semiconductor device, a camera device and a method for controlling data processor.
本发明提供一种数据处理电路、半导体装置、摄像装置及数据处理装置的控制方法。
The present invention provides methods and apparatus for processing semiconductor substrates.
本发明提供一种用于处理半导体基板的装置。
Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.
半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。
Computer chip: or chip; integrated circuit or small wafer of semiconductor material embedded with integrated circuitry, comprises the processing and memory units of the modern digital computer.
芯片：集成电路或嵌入集成电路的小而薄的半导体，包含现代数字计算机的处理和记忆装置。
Our company widely applies in stone material, ceramics, brake lining, metal, semiconductor and other material domains and so on cut and polished processing.
我公司产品广泛用于石材、陶瓷、刹车片、金属、半导体及其他材料的切磨加工等领域。
SRB was verified on three different scale semiconductor wafer fabrication facilities simulation models by applying various dispatching rules on non-batch processing machines.
基于三种不同规模的半导体生产线模型，在非批加工设备使用不同的调度规则的情况下，对提出的SRB进行了仿真验证。
The system is composed of a semiconductor laser source, a main fine mechanic system and controller, a real-time controlling system with SCM and data processing system by PC.
该系统主要由半导体激光光源、准直扩束整形光学系统、主体精密机械系统、单片机控制系统和计算机实时数据处理系统等组成。
The invention relates to a system for semiconductor manufacture, comprising at least a processing tool, a buffer, an input load port, an output load port and a track diameter module.
本发明是有关于一种用于半导体制造的系统，至少包含一制程工具，一缓冲器，一输入负载埠，一输出负载埠，与一轨径模组。
The invention provides a semiconductor wafer, a semiconductor chip and a method and an apparatus for processing the wafer.
本发明提供了半导体晶片、半导体芯片及处理晶片的方法和设备。
The invention provides a semiconductor wafer, a semiconductor chip and a method and an apparatus for processing the wafer.
本发明提供了半导体晶片、半导体芯片及处理晶片的方法和设备。
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