With the development of semiconductor process technology a system on a PCB (Printed Circuit Board) which is composed of several ICs can be integrated into a chip.
随着集成电路工艺的飞速发展，人们已经可以将原先的板级系统集成在一块芯片上，系统芯片逐渐成为集成电路设计的主流发展趋势。
With the development of semiconductor process technology, nowadays a system on a PCB (Printed Circuit Board) which is composed of several ICs can be integrated into a chip.
随着集成电路制造工艺的飞速发展，人们已经可以将原先用各种电路搭建的板极系统集成在一块芯片上。
But PLLs design process involves much theory and application base, such as signal and system, integrated electronics, layout, semiconductor technology, measurement etc.
但是锁相环的设计过程，涉及到信号与系统、集成电子学、版图、半导体工艺和测试等方面，难度比较大。
In the research process of steady laser source system, analyzed thoroughly semiconductor laser and fiber coupling technology, and gained an applied and simple coupling mode.
稳定光源系统研制过程中，对半导体激光器与光纤的耦合技术进行了研究分析，得到了一种简单实用的耦合方式。
Introduction to semiconductor manufacturing technology including oxidation, diffusion, alloying, re-flow process, copper process and chemical-mechanical polishing.
半导体制程技术包括氧化、扩散、热处理、合金化、再流动制程、铜制程及化学机械研磨制程简介。
The invention discloses a process for preparing a well of a semiconductor device, which relates to the fabrication technology of a former semiconductor.
本发明公开了一种半导体器件阱的制造方法，涉及半导体前道的制造工艺。
At present, the semiconductor devices used in the manufacturing process of etching technology, in the lab has produced sub-micron mechanical components.
目前，利用半导体器件制造过程中的蚀刻技术，在实验室中已制造出亚微米级的机械元件。
The capillary array photocatalytic reactor and its making process and application belong to the field of nanometer semiconductor material photocatalytic reactor technology.
一种毛细管阵列光催化反应器及其制备和应用，属纳米半导体材料光催化反应器及其制备和应用的技术领域。
As the semiconductor manufacturing process technology into the deep sub-micron or even nanometer, power consumption is becoming increasingly prominent.
随着集成电路工艺制程进入超深亚微米甚至纳米级，集成电路的功耗问题显得日益突出。
As the semiconductor manufacturing process technology into the deep sub-micron or even nanometer, power consumption is becoming increasingly prominent.
随着集成电路工艺制程进入超深亚微米甚至纳米级，集成电路的功耗问题显得日益突出。
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