Due to semiconductor process we must trade off between input voltage standing wave ratio (VSWR) and Noise Figure. In this paper, a balanced LNA is adopted.
由于半导体工艺制程的关系，一般来说低噪声放大器噪声匹配和输入端驻波比匹配是矛盾的。
With the development of semiconductor process technology a system on a PCB (Printed Circuit Board) which is composed of several ICs can be integrated into a chip.
随着集成电路工艺的飞速发展，人们已经可以将原先的板级系统集成在一块芯片上，系统芯片逐渐成为集成电路设计的主流发展趋势。
With the development of semiconductor process technology, nowadays a system on a PCB (Printed Circuit Board) which is composed of several ICs can be integrated into a chip.
随着集成电路制造工艺的飞速发展，人们已经可以将原先用各种电路搭建的板极系统集成在一块芯片上。
The Schottky diode and the method of making same same can meet the requirements of metal-oxide-semiconductor process and be suitable for integrated production of sub-micro IC also.
该肖特基二极管及其制造方法能够满足金属氧化物半导体工艺的需求，并适用于亚微米集成电路的集成生产。
The Quad PD Arrays consist of four photodiodes monolithically integrated on a common indium phosphide (InP) substrate, and are fabricated using a low FIT rate InGaAs/InP semiconductor process.
方形光二极管阵列包括四个集成在通用磷化铟（InP）衬底上的光二极管单片集成电路，采用低制造、集成与测试率的铟镓砷化物/磷化铟半导体工艺制造。
This paper overviews the application of laser interferometer in the precision analysis of semiconductor process equipment. The laser straightening effecting on linear measuring is introduced.
概述了激光干涉仪在半导体工艺设备精度分析领域的应用，简单介绍了光路准直对线性测长的影响。
It was early in the semiconductor manufacturing has been widely used, is an indispensable process in semiconductor manufacturing.
它早在半导体制造中得到了广泛应用，是半导体制造不可缺少的工艺。
A scheduling model, with the objective of minimizing the average WIP (work in Process) level, is built based on the fluid network model of semiconductor manufacturing systems.
在半导体制造系统流体网络模型的基础上，建立了以减小平均在制品水平为目标的可分解的优化调度模型。
But PLLs design process involves much theory and application base, such as signal and system, integrated electronics, layout, semiconductor technology, measurement etc.
但是锁相环的设计过程，涉及到信号与系统、集成电子学、版图、半导体工艺和测试等方面，难度比较大。
The process variation accounts for deviations in the semiconductor fabrication process.
工艺参数的变异导致半导体制造过程的偏差。
In modern semiconductor industry, volatile organic compounds (VOC) generated during producing process have become one of key problems which affect on product qualities.
现代半导体洁净室中，生产过程所产生的有机挥发物(VOC)已成为影响产品品质的关键问题之一。
Fabrication process of some kind semiconductor photodetectors are presented. Device characteristics and their applications are reviewed.
本文将介绍几种半导体光电探测器的研制工艺、器件特性及其应用举例。
Or perhaps you need something more elaborate, like a whole process control system for a semiconductor manufacturing facility, and you need to provide control signals to the plant.
在半导体制造企业中，或许你需要为工厂提供详细的整个半导体生产设施的过程控制系统的控制信号用以控制半导体生产设施。
Other semiconductor and photovoltaic components are likewise made by chemical process, often relying on high specificity mixtures.
其它的半导体和光电元件也由类似的化学过程制成，还常常依赖于高性能的特殊混合物质。
Optical transition effect is a fundamental physical process in the narrow gap semiconductor infrared detectors.
光电跃迁效应是窄禁带半导体红外探测器的基本物理过程。
Based on actual measurement results, the influence of process quality of semiconductor substrate wafers on epitaxial growth is described.
本文根据实际测量结果，一叙述了半导体衬底制片质量对外延生长的影响。
PCB etching, Semiconductor manufacturing process of conveying of high purity chemical liquid.
电路板的蚀刻；半导体生产过程中输送高纯度化学液。
In the method, a subset of a semiconductor manufacturing process sequence and build is analyzed for optimization.
在该方法中，分析半导体制造工艺顺和构造的子集用于优化。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
In the research process of steady laser source system, analyzed thoroughly semiconductor laser and fiber coupling technology, and gained an applied and simple coupling mode.
稳定光源系统研制过程中，对半导体激光器与光纤的耦合技术进行了研究分析，得到了一种简单实用的耦合方式。
It is one of main use of process simulation with SUPREM to gain semiconductor IC process conditions, This paper will introduce how to gain automatically IC process conditions in the proper algorithm.
利用SUPREM进行半导体集成电路工艺条件的萃取是工艺模拟的主要用途之一。本文介绍如何利用适当的算法进行工艺条件的自动萃取。
The invention provides a composition for under-resist film formation which is for use in a lithographic process for producing a semiconductor device.
本发明的课题是提供在半导体装置制造的光刻工艺中使用的形成抗蚀剂下层膜的组合物。
The present invention relates to the MOCVD equipment and process of growing semiconductor ZnO film with wide band gap.
本发明涉及一种用于生长宽带隙半导体氧化锌薄膜的MOCVD设备及其工艺。
Integrated circuit packaging is a backend process of semiconductor industry. Due to the modeling diversification of assembly, process accuracy is required to higher quality.
积体电路封装为整个半导体产业后半段制程，然而封装的型式多样化，相对的制程精准度要求也越来越高。
The object of the invention is to obtain a semiconductor storage which operates stably and can be produced by an MOS process.
本发明的目的在于，获得可用MOS工艺制造的、且可实现稳定动 作的半导体存储装置。
On a vertical semiconductor element, the light emitting benefit of the element is increased due to the irregular surface formed by a manufacture process.
在垂直半导体元件上，由于制造工艺形成的不规则表面更增加元件的发光效益。
Introduction to semiconductor manufacturing technology including oxidation, diffusion, alloying, re-flow process, copper process and chemical-mechanical polishing.
半导体制程技术包括氧化、扩散、热处理、合金化、再流动制程、铜制程及化学机械研磨制程简介。
There are so many process parameters affecting bond quality in wire bonding and these parameters are directly related to the reliability of semiconductor device.
引线键合过程中的工艺参数较多，他们直接影响键合质量的好坏，影响半导体器件的可靠性。
This process insures reliability and consistency making them ideal for use in biotechnology and semiconductor instrumentation.
这种制作程序确保了可靠性和一致性，非常适用于生物技术和半导体设备中。
P-type semiconductor zinc oxide films, process for preparation thereof, and pulsed laser deposition method using transparent substrates.
型半导体氧化锌薄膜，其制备方法，和使用透明基片的脉冲激光沉积方法。
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