Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation.
自动冲切成形系统是半导体集成电路封装引线框架后的加工专用系统。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；
Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
We continue to lead the industry in universal device support for programmable semiconductor devices by releasing new programming algorithms 5 times per week.
我们会每星期发行三次新的编译算法以继续领导工业对半导体器件的通用器件支持。
Today, semiconductor products use high-lead containing solder for a die attach material in various devices.
今天，半导体产品使用高含铅的各种设备，模具材料附着焊锡。
Today, semiconductor products use high-lead containing solder for a die attach material in various devices.
今天，半导体产品使用高含铅的各种设备，模具材料附着焊锡。
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