The semiconductor element is provided with a substrate;
该半导体元件具有：基板；
Laser based splitting method, object to be split, and semiconductor element chip.
基于激光的分割方法，待分割物体，和半导体元件芯片。
The present invention brings forward a method for determining leakage currents in integrated circuit and metal oxide semiconductor element.
本发明提出一种集成电路及金属氧化物半导体元件中判断漏电流的方法。
The invention provides a power semiconductor module with improved inner structure, thus at least one power semiconductor element can be protected.
本发明提供了一种具有改进的内部结构的功率半导体模块，由此也达到保护至少一个功率半导体元件的目的。
Provided is a semiconductor element which excels in both mechanical reliability and electrical reliability. A structure having such semiconductor element mounted thereon is also provided.
本发明提供一种在机械可靠性及电可靠性两方面均优越的半导体元件及该半导体元件的实装结构体。
The invention disclosed a metal oxide semiconductor element with voltage stabilization and electrostatic discharge protection and a manufacturing method thereof, which is applied to a chip.
本发明公开了一种具稳压及静电放电防护的金属氧化物半导体元件及其制造方法，其应用于一芯片。
One object of the invention is to integrate a fine structure and a semiconductor element for controlling the fine structure onto one insulating surface in one step to further reduce the cost.
本发明的一个目的是通过将微细结构和用于控制微细结构的半导体元件在一个步骤中集成在一个绝缘表面上来进一步降低成本。
Semiconductor element, organic transistor, light-emitting device, and electronic device.
半导体元件，有机晶体管，发光器件，和电子器件。
Semiconductor element, organic transistor, light-emitting device, and electronic device.
半导体元件，有机晶体管，发光器件，和电子器件。
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