OMNEX is the only company authorized to deliver training for the Semiconductor Assembly Council (SAC).
OMNEX是唯一的公司授权了交付为半导体训练汇编委员会(囊)。
Amkor helped make these visions a reality by pioneering the outsourcing of semiconductor assembly and test services.
安靠率先通过外包半导体封装和测试服务方式使这些幻想变成现实。
The semiconductor assembly further includes metallization (36) situated over at least a portion of the insulation and interconnecting the backside contact pads.
该半导体组件还包括涂覆金属(36)，该涂覆金属位于绝缘体的至少一部分之上并互相连接背面接触垫。
There are three parts in the dissertation: MCM-41 mesoporous material and semiconductor assembly, MCM-41 and fluorescence dye Eosin Y assembly, and MCM-41 and rare earth complex assembly.
本论文分为三部分，分别为介孔材料MCM-41与半导体硫化镉的组装，MCM-41与荧光染料曙红的组装以及MCM-41与有机发光配合物铕-苯甲酸-邻菲咯啉的组装。
A kind of particle swarm optimization method with the characteristic of logical time-sequenced is proposed and applied to procedure parameters optimization of semiconductor assembly product line.
提出一种具有逻辑时序特征的微粒群优化算法，并将其应用于半导体封装生产线的工序参数优化中。
Its products are routinely used in applications demanding highly precise, controlled movement including: robotics, medical, assembly, semiconductor, packaging, engraving and pick-and-place.
其产品广泛用于需要高精度、运转控制的应用中，包括：机器人、医学、组装、半导体、包装、雕刻和分拣。
This article describes the assembly and connection technology, the integration, and the challenge of semiconductor module.
本文针列功率半导体模块的集成度、装配和连接技术。
The invention relates to an adhesive film composition for assembly of semiconductor, an adhesive film and scribing crystal particle binding film.
本发明涉及一种半导体装配用胶粘剂膜组合物、胶粘剂膜以及划片晶粒粘结膜。
Gantry robots are widely used for precision manufacturing tasks such as circuit board assembly and semiconductor end-package et al.
拱架机器人广泛地应用于各种精密制造领域，例如表面贴装设备、半导体后封装设备等。
Integrated circuit packaging is a backend process of semiconductor industry. Due to the modeling diversification of assembly, process accuracy is required to higher quality.
积体电路封装为整个半导体产业后半段制程，然而封装的型式多样化，相对的制程精准度要求也越来越高。
This results in an improved lifetime of an assembly, in which the semiconductor component is connected to an external substrate by the projecting electrode.
这使得组件寿命得以提高，在组件中半导体元件通过凸出电极连接至外部基片。
The assembly of the film frame tape, the thinned semiconductor substrate, and the C4 grind tape is diced.
切割膜框架带、减薄的半导体衬底和C4研磨带的组件。
I am contacting you on behalf of my client, one of the world leader in intelligent sensing solutions for the electronics assembly and semiconductor equpment markets.
我联系你代表我的当事人之一，世界领先的智能传感解决方案，为电子组装和半导体提供市场。
I am contacting you on behalf of my client, one of the world leader in intelligent sensing solutions for the electronics assembly and semiconductor equpment markets.
我联系你代表我的当事人之一，世界领先的智能传感解决方案，为电子组装和半导体提供市场。
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