In view oi the problems existing in the silicon micro pressure sensors, this paper proposes the chemical etching techniques and the selective etching processes to control diaphragm thickness.

并针对硅微压传感元件研制中存在的问题，提出采用化学腐蚀技术，选择性腐蚀工艺控制膜厚。

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In view oi the problems existing in the silicon micro pressure sensors, this paper proposes the chemical etching techniques and the selective etching processes to control diaphragm thickness.

并针对硅微压传感元件研制中存在的问题，提出采用化学腐蚀技术，选择性腐蚀工艺控制膜厚。

youdao