Changes of microstructure of the thick film platinum resistance paste during drying and sintering were studied by SEM. The main factors influencing tightness of the sintered membrane were discussed.
通过扫描电镜分析，研究了厚膜铂电阻浆料在烘干、烧结过程中微观结构的变化，讨论了烧结过程中对膜层致密度的影响因素。
Changes of microstructure of the thick film platinum resistance paste during drying and sintering were studied by SEM. The main factors influencing tightness of the sintered membrane were discussed.
通过扫描电镜分析，研究了厚膜铂电阻浆料在烘干、烧结过程中微观结构的变化，讨论了烧结过程中对膜层致密度的影响因素。
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