Resin package is be used to decrease size of device, diminish weight, reduce costs and push for miniature.
树脂封装能缩小器件尺寸、减轻重量、降低成本、促进小型化。
Wound with metalized polypropylene film as medium, metal coat as electrode, various outgoing modes and epoxy resin package.
金属化聚丙烯薄膜做介质，金属涂层作电极卷绕而成，多重引出方式环氧树脂包封。
The production situation and the application of synthetic resin in agriculture, construction, automobile, electronics and package in China were introduced, and its development trend was predicted.
介绍了国内合成树脂的生产现状及其在农业、建筑、汽车、电子工业、包装业等领域的应用情况，并对其发展趋势进行了预测。
This special polyolefin liquid packaging resin may replace LDPE heavyduty packaging bags and can be used for the package of all kinds of materials.
这种液体包装专用料也可以代替LDPE重包装料制成重包装袋，用于包装各类材料。
A review is given to the progress of one-package liquid epoxy resin coatings in recent years.
本文综述了近年来一液型环氧树脂涂料的新进展。
This article, taking silica as example, mainly discusses filler types and their respective function in package resin, as well as its influence on package resin performance.
文章主要从封装树脂用填充剂的种类以及在封装树脂中的作用进行阐述，并以二氧化硅为例来研究分析填充剂对封装树脂主要性能的影响。
A fluoropolymer compounded with a nucleating package. The nucleating package in this resin, when combined with nitrogen gas injection, forms uniform foam cells in the insulation. .
一个用氟树脂复合成核包。在这种树脂，当氮气注入相结合，在核封装形式均匀的绝缘泡沫细胞。
Structure: Adopting metal stacked technology. Epoxy resin as dip sealed, plastic case as external package.
采用金属化叠片技术，环氧树脂为灌注材料，外部用塑壳封装。
2003 years, 2004 workshop resin raw materials, bake, package three varieties certification ;
2003年、2004年原料车间精、烘、包三个品种的认证；
LED is the heart of a semiconductor chip, the chip is attached to one end of a stent, is the negative side, the other end of the power of the cathode, the entire chip package to be epoxy resin.
LED的心脏是一个半导体的晶片，晶片的一端附在一个支架上，一端是负极，另一端连接电源的正极，使整个晶片被环氧树脂封装起来。
LED is the heart of a semiconductor chip, the chip is attached to one end of a stent, is the negative side, the other end of the power of the cathode, the entire chip package to be epoxy resin.
LED的心脏是一个半导体的晶片，晶片的一端附在一个支架上，一端是负极，另一端连接电源的正极，使整个晶片被环氧树脂封装起来。
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