However, the position of the solder joints formed (underneath the chip) after reflow means that visual inspection is impossible.
回流后在芯片下方形成焊点的位置表明，目检是不可能的。
However, the position of the solder joints formed (underneath the chip) after reflow means that visual inspection is impossible.
回流后在芯片下方形成焊点的位置表明，目检是不可能的。
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