Aiming at the technology demand of advanced copper interconnection, the effect of pulse current density on cu layer properties such as resistance, crystal size and surface roughness were investigated.
针对先进纳米铜互连技术的要求，研究了脉冲电流密度对铜互连线电阻率、晶粒尺寸和表面粗糙度等性能的影响。
Aiming at the technology demand of advanced copper interconnection, the effect of pulse current density on cu layer properties such as resistance, crystal size and surface roughness were investigated.
针对先进纳米铜互连技术的要求，研究了脉冲电流密度对铜互连线电阻率、晶粒尺寸和表面粗糙度等性能的影响。
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