• Of the three, Electroglas continues to be the only company focused on wafer probing technology and remains the technology leader in this segment.

    值得一提,伊智公司是三者之中,惟一一家始终致力于晶圆探针技术研究的公司,保持该领域处于技术领先地位

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  • This paper has put forward the probing into study method in information technology teaching and has compared the probing into study with accepting study.

    通过探究学习接受性学习的比较提出了信息技术教学中探究性学习的实施方法

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  • Probing with multimedia technology for fundamental new fashioned teaching platform becomes an importance problem each educator faces.

    探索多媒体技术基础新型教学模式已成为每个教育工作者面临重要课题

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  • In this dissertation, we conduct research and probing on database encryption technology and its application according to some Financial Management System.

    论文结合财政管理系统数据库加密技术及其应用进行研究探讨

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  • With the single axial loading system and the infrared hot image technology, a probing test research on infrared radiation changes of the coal and rock deformation in Shanxi Shuiyu Mine was conducted.

    利用加载系统红外成像技术,对山西变形过程中的红外辐射变化进行了探测试验研究

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  • Probing into the technical rootstocks of the dissimilation of technology is beneficial to our thorough understanding about nature and the value of technology.

    探讨技术异化技术根源,有助于人们深入认识技术本质价值

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  • EPG is an electrical physiological technology which is used to study the probing and feeding behavior of piercing sucking insects.

    电波图(EPG)用于研究吸式口器昆虫取食生理技术

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  • The new mathematics curriculum concept of senior high school places stressing on the combination of information technology and mathematics curriculum, advocates active, probing studying method.

    高中数学课程理念提出要注重信息技术数学课程整合倡导积极主动勇于探索学习方式。

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  • This article introduces the advantages of CAI technology of multi media as well as probing into its use in PE.

    介绍多媒体CAI技术优越性探讨多媒体CAI技术体育教学中的应用

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  • In the last two years, Electroglas has made major new technology introductions for 200mm and 300mm wafer probing and final test handling.

    过去年中主要200mm300 mm圆探针台和封装测试处理引入新的技术

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  • In the last two years, Electroglas has made major new technology introductions for 200mm and 300mm wafer probing and final test handling.

    过去年中主要200mm300 mm圆探针台和封装测试处理引入新的技术

    youdao

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