The hot embossing and bonding machines have been used practically in microfluidic chip automatic fabrication, and the chips have satisfactory quality, precision, repetition and consistency.
塑料微流控芯片热压键合设备已经投入自动化生产，生产的芯片质量、精度、重复性和一致性良好。
But it is not suit for precision dies, such as the folding and riveting die for the stators and rotators of motors. For precision dies, the method of bonding the guide bushes with glue is applicable.
但此方法用于精密模具(如电机定转子叠铆模)则有一定的弊端，用胶水粘接导套的方法可适用于精密模具。
Ultrasonic wave bonding and precision positioning at high speed are key technologies.
焊和高速高精度运动定位技术是关键技术。
A design of bonder motion control system was proposed based on DSP FPGA, has realized the high speed and high precision control to the movement of line motor in the bonding platform.
提出了一种基于DSPFPGA的键合机运动控制系统设计方案，实现了对键合机平台中直线电机的高速高精运动控制。
A design of bonder motion control system was proposed based on DSP FPGA, has realized the high speed and high precision control to the movement of line motor in the bonding platform.
提出了一种基于DSPFPGA的键合机运动控制系统设计方案，实现了对键合机平台中直线电机的高速高精运动控制。
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