Chemical-Mechanical % polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
Chemical-Mechanical polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
For a bright glossy surface on your anodized part, steel wool or wet sand it and then polish it with a buffing wheel using tripoli compound.
需要明亮的光泽，则需要用钢丝球或者湿的砂纸磨，之后用硅藻土抛光轮抛光。
Buffing head works from coarse grinding to fine polishing progressively. This line is able to polish mass volume products.
磨头分别按粗磨到精抛依次抛磨，能满足大批量产品抛磨。
Buffing head works from coarse grinding to fine polishing progressively. This line is able to polish mass volume products.
磨头分别按粗磨到精抛依次抛磨，能满足大批量产品抛磨。
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