Resist: coating material used to mask or to protect selected areas of a pattern from the action of an etchant solder or plating.
阻剂：用来选择性保护某图形区域免受蚀刻剂，焊料或电镀影响的涂层材料。
Tin plating: Immediately after copper plating, a thin layer(0003") of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process."
镀锡：镀铜后在铜表面再镀上一层锡，大约3mil厚，在下工序中起到抗蚀保护线路的作用。
Tin plating: Immediately after copper plating, a thin layer(0003") of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process."
镀锡：镀铜后在铜表面再镀上一层锡，大约3mil厚，在下工序中起到抗蚀保护线路的作用。
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