BH-88 trivalent chromium sulfate plating process was chosen.
选用BH- 88硫酸盐三价铬镀铬工艺。
A low cyanide bright 22k gold plating process was investigated.
研究了一种低氰电镀光亮22K金工艺。
A new non-cyanide alkaline copper plating process was introduced.
介绍了一种新的无氰碱铜工艺。
A multilayer nickel plating process is suggested for motorcycle parts.
提出一种适用于摩托车零件的多层镍电镀工艺。
Is the copper plating process an electrolytic acid copper plating system?
电镀站是否有酸解电镀铜系统？
The preparation of sawing wire base and the sawing wire plating process are introduced.
研制了一种新型环形电镀金刚石线锯，介绍了锯丝基体的制备及锯丝电镀工艺。
Formate-A acid system was a sulfate trivalent chromium plating process with low concentration.
甲酸-羧酸a体系是一种低浓度的硫酸盐三价铬电镀工艺。
An electroless nickel plating process with high deposition rate was optimized by orthogonal test.
通过正交试验法优选出一种具有高磷含量的快速化学镀镍工艺配方。
A new rhodium plating process applicable to printed circuit board was optimized by orthogonal test.
通过正交试验优选出一种用于印刷电路板的镀铑新工艺。
A new decorative chromium plating process for aluminium substrate is described with formulas given.
介绍一种在铝基体上装饰镀铬的新工艺及其配方。
A self-limiting electroless plating process is provided to plate thin films with improved uniformity.
本发明提供一种自限制化学镀方法，以镀具有改进的均匀性的膜。
Characteristics of BH-332 low Cyanide zinc plating process and maintenance of the bath are described.
着重介绍BH—332低氰镀锌工艺的特点和镀液的维护。
The bath formulation and operating conditions of an imitation stainless steel plating process were introduced.
介绍了一种仿不锈钢电镀工艺配方和操作条件。
Some hydrogen is absorbed during the acid cleaning and processing procedure of the mechanical plating process.
经过酸洗并机械镀的零件会吸收一些氢。
The effects of operation conditions on the rate of deposition are studied and the optimum plating process is defined.
研究了操作条件对沉积速度的影响，确定了最佳工艺条件。
The plating (layers) such as Ni, Cu and Ni-Cu formed on the CNTs surface by chemical plating process were investigated.
应用化学镀层法对改性后的CNT镀镍、铜及镍铜混合镀层技术进行了一系列研究。
The authors expect electroplaters to try their best to accelerate the application of the zinc alloy plating process in China.
电镀工作者应加快步伐推进锌合金在国内的应用。
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
The article presents elementary fruit of our research on how screws and clock parts are coated with aluminium by ion-plating process.
本文主要介绍螺钉、螺帽和钟表零件的离子镀渗铝镀膜性能初步研究成果． 文中着重研究了铝镀膜的性能和组织结构。
The effect of rare earths on the chemical pre-plating process for electro-deposition of foamy copper was studied through experiments.
通过实验手段，研究了稀土对电沉积法制备泡沫铜化学预镀工艺的影响。
Zinc based RE alloy coating was obtained on the surface of steel samples by adding RE metal salts during the mechanical plating process.
通过在机械镀锌过程中添加不同量的稀土金属盐，在钢铁试样表面形成不同成分含量的锌基稀土合金镀层。
Factors influencing corrosion resistance of galvanized steel-wire in continuous plating process and measurements to be taken were described.
研究了钢丝拉镀锌生产中影响镀锌层耐蚀性的各种因素，并提出可采取的一些具体措施。
The purpose of this paper is from chemical, physical & substrate aspects to explore several influence factors of via-filling plating process.
分别从化学、物理及基板三方面探讨了影响电镀填孔工艺的一些基本因素。
Hydrogen brittleness: because, in addition to the erosion oil or plating process such as metal and alloy hydrogen atom absorption and cause brittle.
氢脆：由于浸蚀，除油或电镀等过程中金属或合金吸收氢原子而引起的脆性。
The automatic control in iron - plating process is got by the key equipment-the power supply system, this paper will give a detailed explanation for it.
镀铁过程的自动控制是通过其关键设备——供电系统来实现的，本文对此做了详尽的叙述。
The paper mainly focus on the development of hot dip aluminized coating, and analyzes the composing mechanism of plating process and its microstructure.
对热浸铝的历史进行了简要回顾，分析了其镀层组织结构及形成机理。
The paper mainly focus on the development of hot dip aluminized coating, and analyzes the composing mechanism of plating process and its microstructure.
对热浸铝的历史进行了简要回顾，分析了其镀层组织结构及形成机理。
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