The plasma theory, plasma cleaning mechanisms and applications for plasma cleaning system are described.
简要介绍了低温等离子体清洗设备清洗机理、特点及其应用。
It is pointed out that the plasma cleaning and the pulsed corona discharge are the better methods to get rid of harmful gases.
指出等离子体净化和脉冲电晕放电是净化有害气体的较好方法。
Many other cleaning applications of plasma are being researched.
等离子体在许多其他清洁应用方面的研究还在进行中。
The electronics industry uses it in plasma and thermal cleaning applications for its advantages such as high etch rates, high selectivity, carbon-free etching, and minimal residual contamination.
由于它的优点，如高蚀刻率、高选择性、无碳蚀刻和最小限度的残留污染，电子工业把它用在等离子和热清洁应用中。
According to the current application, there are three major aspects of the Plasma application in the PCB industry, including cleaning, activation and etchback.
就目前来看，等离子体在PCB行业中的应用主要有三种：清洁、活化和凹蚀。
A new ejecting removal mechanism of particles is presented based on particle elastic deformation to overcome the flaws of rolling removal mechanism in laser-induced plasma shock wave cleaning.
针对激光等离子体冲击波清洗颗粒技术中的滚动移除机制缺陷，提出一种基于颗粒弹性形变的弹出移除模型。
The whole blood viscosity (high and low shearing), plasma viscosity, haematocrit, whole blood reduced viscosity and K value equation were detected with the auto cleaning rotating viscometer.
采用自清洗旋转式黏度计检测高血压患者全血黏度(高、低切)、血浆比黏度、红细胞压积、全血还原黏度和K值方程。
Plasma tea fruit and vegetable washing machine to the above cleaning can achieve clean, non-toxic, tasteless, safe and reliable.
等离子茶叶果蔬清洗机对以上的清洗可达到清洁、无毒、无味、安全可靠。
The technology of discharge plasma has its unique effect on the cleaning of indoor environment.
放电等离子体技术在净化居室环境方面具有独特的作用。
The cleaning of hydrogen and nitrogen ECR plasma on sapphire substrates are carried out in the calibrated temperature system and evaluated by analyzing RHEED image in ECR-PEMOCVD system.
最后讨论了在经过校温的系统上进行蓝宝石衬底的氢氮等离子体清洗实验，并通过RHEED图像评价清洗结果质量。
A better result is got when cleaning sapphire by the plasma of hydrogen mixed with nitrogen.
实验中采用了氢氮混合等离子体清洗的方法，提高了清洗的质量。
Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.
等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
Environment pollution problem generated by plasma cutting smoke and dust during SSAW pipe production process was analyzed; a kind of stable and reliable smoke and dust cleaning system was designed.
针对螺旋埋弧焊钢管生产中空气等离子切割烟尘对环境污染的问题，设计了一种工作稳定可靠的烟尘净化系统。
In one embodiment, a low energy plasma is used during the cleaning step.
在一实施例中，于清洁步骤中使用低能量等离子体。
In one embodiment, a low energy plasma is used during the cleaning step.
在一实施例中，于清洁步骤中使用低能量等离子体。
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