As the demand increasing steadily for small volume, high density and high heat-dissipation rate IC, the key parameter of wire bonding — pad pitch has to shrink in accordance.
由于市场对小体积、高集成度和高散热率芯片的需求量与日俱增，引线键合工艺的关键参数——焊盘间距也不断缩小以满足市场要求。
Although a larger volume of the pad would result in a longer reaction time, it may be counteracted by a reactant dilution causing a decreased signal and also an unacceptably long assay (8).
更大的衬垫体积会导致更长的反应时间，也会因反应物的稀释造成信号减弱，并且是个不能接受的长检测。
Although a larger volume of the pad would result in a longer reaction time, it may be counteracted by a reactant dilution causing a decreased signal and also an unacceptably long assay (8).
更大的衬垫体积会导致更长的反应时间，也会因反应物的稀释造成信号减弱，并且是个不能接受的长检测。
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