Each of these packaging technologies has different area of applications and unique properties.
这两项先进封装技术有着各自不同的特征和应用范围。
They're photographed and cataloged , creating an electronic database of packaging technologies and ideas.
他们拍照和编目，建立一个电子数据库的包装技术和想法。
Many new packaging technologies and package types are developed to meet these stringent requirements of mobile communication.
为了满足上诉移动通讯产品的苛刻要求，大量的新兴电子封装技术和封装产品应运而生。
Circulated in the Asia Pacific, we report on new processing and packaging technologies as well as ingredients, additives and flavors.
亚太地区发行，报导最新食品和饮料行业的加工和包装技术，以及调料、添加剂和香料方面的信息。
Microwave volume packaging technologies are effective methods for realizing microwave modules miniaturization and weight reduction with high density and good performance.
微波立体组装工艺是实现微波组件小型化、轻量化、高组装密度和优良电气性能的有效途径。
Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.
多芯片模块现在采用的有机层压板(MCM - L)、陶瓷(MCM - C)和沉积薄膜(MCM - D)的封装技术。
The research on the packaging information is an important aspect in packaging science, and packaging information technology is one of the impotent technologies in packaging design.
包装信息的研究是包装科学研究的一个重要方面，包装信息技术是包装设计中的一项重要技术。
Among the products security technologies, one of the main means is the packaging printing, and security technology of packaging material is an important way of packaging printing in security.
在产品的防伪技术中，包装防伪是一种主要的防伪手段，而包装材料防伪是包装防伪的一种重要方式。
According to the physiological characteristic of litchi, some proper fresh-keeping technologies of film packaging were put forward.
根据荔枝的生理特征和影响荔枝褐变和腐烂的因素，提出了适合荔枝的薄膜包装保鲜技术。
The digital anti-counterfeiting is the mainstream of domestic anti-counterfeiting technologies, which was widely applied in domains of product packaging and electronic commerce.
数码防伪是国内主流的防伪技术，广泛应用于产品包装、电子商务等领域。
It is noted that microelectronic packaging technology becomes one of the most important and challenging technologies in radar and all other electronic products.
令人瞩目的是微电子组装技术正在成为现代雷达及其他电子设备中最重要的关键技术之一。
The difination, evolution, status and supporting technologies of wafer-level packaging are introduced and reviewed in this paper.
本文对圆片级封装的定义、演变、进展状况及支撑技术进行了介绍和分析评论。
The manufacture of solder bump is one of the key technologies for area array packaging (AAP).
钎料凸台和互连焊点的重熔是面阵封装的关键技术之一。
Multi-chip packaging ( MCP ) technologies and their basi status, state-of-art of applications for mobile phone memory are reviewed in this paper.
文章评述多芯片封装技术及目前的基本情况，这一技术在手机存储器的应用现状等。
Finally, some kinds of combined inspection technologies based on AOI in electronic assembling packaging are introduced in this article.
最后介绍了几种基于AOI的电子组装综合检测技术。
Our Company possesses a group of high quality specialized talents whom devote to making the best packaging machinery using the latest technologies.
本公司拥有一批高素质的专业人才，结合先进的技术，做最好的包装机。
Palomar Technologies Model 3500-III performs fully automatic wafer scale packaging and advanced microelectronics assembly.
帕洛马技术3500III执行全自动晶圆级封装和先进的微电子组装。
In 2004, Freescale joined STMicroelectronics, Infineon Technologies and Philips electronics NV in a consortium intended to promote lead-free packaging.
2004年，飞思卡尔加入旨在推动无铅封装的一个财团意法半导体，英飞凌科技和飞利浦电子公司。
In 2004, Freescale joined STMicroelectronics, Infineon Technologies and Philips electronics NV in a consortium intended to promote lead-free packaging.
2004年，飞思卡尔加入旨在推动无铅封装的一个财团意法半导体，英飞凌科技和飞利浦电子公司。
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