J2EE defines a very specific packaging structure that separates the various artifacts into different archives.
J2EE定义了非常详细的包结构，把各种不同的构件分离在不同的档案库。
We will use the next several pages to detail the configuration files and packaging structure of the sample application.
我们将用下面几页来详细讲解示例应用的配置文档和打包后的目录结构。
Developers must use a proper packaging structure (such as custom namespace mapping while generating objects from WSDL) while creating these objects to avoid overwriting existing classes.
开发人员在创建这些对象时必须使用恰当的封装结构以避免重写现有的类(例如从WSDL生成对象时定制命名空间映射)。
High performance can be obtained for the integrated power electronics module (IPEM) by using a three-dimensional packaging structure instead of a planar structure.
采用三维封装结构取代传统的平面封装结构可获得高性能集成电力电子模块。
The modal frequency of the packaging structure increases with the elastic modulus of potting material.
封装结构的模态频率随着灌封胶弹性模量的增大而增大。
The suspending cushion packaging structure was designed to protect instruments of 20g in airdrop supply.
设计一种悬挂式缓冲包装结构，在空投补给时对脆值为20g左右的仪器提供缓冲保护。
Therefore, the study of more favorable new packaging materials and packaging structure is extremely important.
因此，研究性能更为优越新型包装材料和包装结构形式极其重要。
The leadless packaging structure reduces the packaging size of the semiconductor device and reduces the product cost.
本发明缩小了半导体器件的封装尺寸，降低了产品成本。
The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
It is necessary to determine the elastic constants of molded pulp material in advance for analyzing the packaging structure made of molded pulp by finite element method.
用有限元法分析纸浆模塑包装结构，需要事先确定纸浆模塑材料的弹性常数。
A packaging structure of high-power LED was presented, microlens array was employed in the secondary optical design, optical properties of the package was studied using Trace pro.
建立了一种大功率LED的封装结构，二次光学设计采用了微透镜阵列技术，运用光线追踪法研究了这种封装结构的光学性能。
The pattern metal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.
图案化金属层位于绝缘层上并填入于导通孔中，以作为本实用新型多芯片封装结构的内连线层。
The developments and existing problems involved in packaging isolation and cushioning, product fragility, cushioning packaging material, packaging structure design, etc. are summarized and analyzed.
对包装防震缓冲、物品易损度、缓冲包装材料、包装防震缓冲设计等方面的进展和存在的问题作了综述和分析。
The developments and existing problems involved in packaging isolation and cushioning, product fragility, cushioning packaging material, packaging structure design, etc. are summarized and analyzed.
对包装防震缓冲、物品易损度、缓冲包装材料、包装防震缓冲设计等方面的进展和存在的问题作了综述和分析。
应用推荐